# US 2025/0210490 A1 · Packaging architecture for photonic components > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0210490 A1 - Document ID: US20250210490A1 - Status: Published application - Kind: A1 - Application number: 18/394,399 - Filed: 2023-12-22 - Published: 2025-06-26 - Earliest claimed: 2023-12-22 - Assignees: Nokia Solutions and Networks Oy - Applicants: Nokia Solutions and Networks Oy - Inventors: Juthika BASAK; Abderrahim EL AMRANI - Web page: https://patentgrep.com/patent/US20250210490A1 ## CPC - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 70/611: {for connecting multiple chips together} - H10W 70/68: Shapes or dispositions thereof - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 90/00: Package configurations - H10W 72/248: {Top-view layouts, e.g. mirror arrays} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/792: {between multiple chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A opto-electronic assembly, including: a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and an interposer, wherein the RFIC is mounted on the PIC and is electrically connected to the PIC, wherein the PIC is mounted and electrically connected to the substrate via the interposer. ## Claims ### Claim 1 An opto-electronic assembly, comprising: a photonic integrated circuit (PIC); a radio frequency integrated circuit (RFIC); a substrate, and an interposer, wherein the RFIC is mounted on the PIC and is electrically connected to the PIC, wherein the PIC is mounted and electrically connected to the substrate via the interposer. ### Claim 2 (depends on 1) The opto-electronic assembly of claim 1, wherein the interposer includes a single piece with a through-hole opening. ### Claim 3 (depends on 1) The opto-electronic assembly of claim 1, wherein the substrate includes a cavity, the substrate and the interposer together define a housing space, and the PIC and the RFIC are located at least partly inside the housing space. ### Claim 4 (depends on 1) The opto-electronic assembly of claim 1, wherein the interposer has an opening that serves as the housing space. ### Claim 5 (depends on 1) The opto-electronic assembly of claim 1, wherein the interposer has a surface oriented toward the PIC and the substrate, the surface overlaps partly with the PIC and partly with the substrate. ### Claim 6 (depends on 1) The opto-electronic assembly of claim 1, wherein the interposer comprises redistribution layers (RDLs) as horizontal interconnects between PIC connector pads and interposer connector pads. ### Claim 7 (depends on 6) The opto-electronic assembly of claim 6, wherein each of the horizontal interconnects connects a plurality of the PIC connector pads with a plurality of substrate pads. ### Claim 8 (depends on 6) The opto-electronic assembly of claim 6, wherein the RDLs within the PIC are used to connect the RFIC via the PIC connector pads to establish an electrical connection to the substrate. ### Claim 9 (depends on 6) The opto-electronic assembly of claim 6, wherein at least some of the horizontal interconnects on the interposer are arranged geometrically in parallel. ### Claim 10 (depends on 6) The opto-electronic assembly of claim 6, wherein the interposer comprises at least one of the following: a single RDL comprising a plurality of electrically conductive lines; and a stack of multiple RDLs, each RDL of the stack comprising a plurality of electrically conductive lines. ### Claim 11 (depends on 10) The opto-electronic assembly of claim 10, wherein the interposer further comprises a single or multiple isolating layers, wherein the RDL is arranged between these isolating layers. ### Claim 12 (depends on 11) The opto-electronic assembly of claim 11, wherein the interposer further comprises a plurality of electrically conductive contact elements, and each of the electrically conductive contact elements traverses the isolating layers. ### Claim 13 (depends on 12) The opto-electronic assembly of claim 12, wherein each of the electrically conductive contact elements connects one of the electrically conductive lines to one of a node on the substrate and a node on the PIC. ### Claim 14 A method for assembling opto-electronic assembly, comprising a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and an interposer, comprising: bonding the RFICs to the PIC to form a first sub-assembly wherein the RFIC and the PIC are electrically connected; bonding the first sub-assembly to the interposer to form a second sub-assembly wherein the PIC and the RFIC are electrically connected to the interposer; and bonding the second sub-assembly to the substrate wherein the interposer is electrically connected to the substrate and wherein the substrate is electrically connected to the PIC and the RFICs via the interposer. ### Claim 15 (depends on 14) The method of claim 14, wherein mounting the first sub-assembly to the interposer uses a pick and place method and mass reflow in a flip chip process. ### Claim 16 (depends on 14) The method of claim 14, wherein mounting the second sub-assembly to the substrate uses pick and place method and mass reflow in a standard flip chip process. ### Claim 17 (depends on 14) The method of claim 14, wherein mounting the RFIC to the PIC uses a chip to wafer bonding process wherein the RFIC at chip level are bonded to the PIC at a wafer level. ### Claim 18 (depends on 17) The method of claim 17, wherein mounting the RFIC to the PIC uses one of pick and place method and mass reflow in a standard flip chip process and pick and place and thermocompression process. ### Claim 19 (depends on 17) The method of claim 17, wherein mounting the RFIC to the PIC uses a hybrid bonding process wherein the electrical connection is established using a direct Copper to Copper bond in conjunction with an oxide to oxide bond. ### Claim 20 A method for assembling opto-electronic assembly, comprising a photonic integrated circuit (PIC), a radio frequency integrated circuit (RFIC), a substrate, and an interposer, comprising: bonding the RFIC and the interposer to the PIC to form a first sub-assembly wherein the RFIC and the PIC and the interposer are electrically connected; and bonding the first sub-assembly to the substrate wherein the interposer is electrically connected to the substrate and wherein the substrate is electrically connected to the PIC via the interposer. ### Claim 21 (depends on 20) The method of claim 20, wherein the interposer includes a first portion and a separate second portion. ### Claim 22 (depends on 20) The method of claim 20, further comprising bonding the RFIC and the interposer to a temporary carrier before mounting the RFIC and the interposer to the PIC; and removing the temporary carrier from the RFIC and the interposer after mounting the RFIC and the interposer to the PIC.