# US 2025/0210312 A1 · Substrate processing apparatus

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- Number: US 2025/0210312 A1
- Document ID: US20250210312A1
- Status: Published application
- Kind: A1
- Application number: 19/002,381
- Filed: 2024-12-26
- Published: 2025-06-26
- Earliest claimed: 2023-12-26
- Assignees: Semes Co., Ltd.
- Applicants: Semes Co., Ltd.
- Inventors: Sun Wook JUNG; Yoon Seok CHOI; Chan Young CHOI; Sung Suk WI; Hyung Bin IM
- Web page: https://patentgrep.com/patent/US20250210312A1

## CPC

- H01J 37/3222: {Antennas}
- H01J 37/32192: {Microwave generated discharge (H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence)}
- H01J 37/32229: {Waveguides}
- H01J 37/32266: {Means for controlling power transmitted to the plasma}
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

Proposed is a substrate processing apparatus. The substrate processing apparatus includes a chamber having a processing space therein, a substrate supporting unit disposed in the processing space and configured to support a substrate, and a microwave unit for supplying microwaves to the processing space. The microwave unit is formed along a circumference of the chamber, and is configured to directly radiate microwaves to the processing space of the chamber and to the substrate.

## Claims

### Claim 1

A substrate processing apparatus comprising:
a chamber having a processing space therein;
a substrate supporting unit disposed in the processing space and configured to support a substrate; and
a microwave unit for supplying microwaves to the processing space,
wherein the microwave unit is formed along a circumference of the chamber, and is configured to directly radiate microwaves to the processing space of the chamber and to the substrate.

### Claim 2 (depends on 1)

The substrate processing apparatus of claim 1, wherein the microwave unit comprises:
a power source for generating the microwaves;
a waveguide for transmitting the microwaves; and
an antenna for transmitting the microwaves, the antenna being formed in a doughnut shape.

### Claim 3 (depends on 2)

The substrate processing apparatus of claim 2, wherein a plurality of output slots is formed in an inner circumference of the antenna.

### Claim 4 (depends on 3)

The substrate processing apparatus of claim 3, wherein the plurality of output slots is disposed to be spaced apart from each other by a predetermined distance along the inner circumference of the antenna.

### Claim 5 (depends on 4)

The substrate processing apparatus of claim 4, wherein the plurality of output slots is disposed as a plurality of layers partitioned in a vertical direction along the inner circumference of the antenna.

### Claim 6 (depends on 5)

The substrate processing apparatus of claim 5, wherein the plurality of output slots has an angle of 90° to 180° with respect to a direction parallel to a surface of the substrate.

### Claim 7 (depends on 1)

The substrate processing apparatus of claim 1, wherein the chamber is formed of quartz.

### Claim 8 (depends on 1)

The substrate processing apparatus of claim 1, wherein a side wall forming the chamber comprises a region recessed toward the processing space from the side wall, and the microwave unit is disposed in the region that is recessed.

### Claim 9 (depends on 1)

The substrate processing apparatus of claim 1, further comprising a microwave unit driving unit for driving the microwave unit up and down.

### Claim 10

A substrate processing apparatus comprising:
a chamber having a processing space therein;
a substrate supporting unit disposed in the processing space and configured to support a substrate;
a gas supply unit for supplying a gas to the processing space;
a plasma generation unit for ionizing the supplied gas into plasma;
a microwave unit for supplying microwaves to the processing space; and
a control unit for controlling the gas supply unit and the plasma generation unit,
wherein the microwave unit is formed along a circumference of the chamber, and is configured to heat the substrate by directly radiating the microwaves to the substrate.

### Claim 11 (depends on 10)

The substrate processing apparatus of claim 10, wherein the microwave unit comprises:
a power source for generating the microwaves;
a waveguide for transmitting the microwaves; and
an antenna for transmitting the microwaves, the antenna being formed in a doughnut shape.

### Claim 12 (depends on 11)

The substrate processing apparatus of claim 11, wherein a plurality of output slots is formed in an inner circumference of the antenna.

### Claim 13 (depends on 12)

The substrate processing apparatus of claim 12, wherein the plurality of output slots is disposed to be spaced apart from each other by a predetermined distance along the inner circumference of the antenna.

### Claim 14 (depends on 10)

The substrate processing apparatus of claim 10, further comprising a microwave unit driving unit for driving the microwave unit up and down.

### Claim 15

A substrate processing apparatus comprising:
a chamber having a processing space therein;
a substrate supporting unit disposed in the processing space and configured to support a substrate;
a gas supply unit for supplying a gas to the processing space;
a microwave unit for supplying microwaves to the processing space; and
a control unit for controlling the gas supply unit and the microwave unit,
wherein the microwave unit is formed along a circumference of the chamber, and is configured to ionize the supplied gas into plasma by directly radiating the microwaves to the processing space of the chamber.

### Claim 16 (depends on 15)

The substrate processing apparatus of claim 15, wherein the microwave unit comprises:
a power source for generating the microwaves;
a waveguide for transmitting the microwaves; and
an antenna for transmitting the microwaves, the antenna being formed in a doughnut shape.

### Claim 17 (depends on 16)

The substrate processing apparatus of claim 16, wherein a plurality of output slots is formed in an inner circumference of the antenna.

### Claim 18 (depends on 17)

The substrate processing apparatus of claim 17, wherein the plurality of output slots is disposed to be spaced apart from each other by a predetermined distance along the inner circumference of the antenna.

### Claim 19 (depends on 15)

The substrate processing apparatus of claim 15, further comprising a microwave unit driving unit for driving the microwave unit up and down.

### Claim 20 (depends on 19)

The substrate processing apparatus of claim 19, wherein the microwave unit is configured to be driven vertically between the gas supply unit and the substrate supporting unit by the microwave unit driving unit.
