Surface-modified aluminum alloy substrate structure
AssigneeAmulaire Thermal Technology, Inc.
InventorsYI-HSIN HUANG, CHING-MING YANG, KUO-WEI LEE, TZE-YANG YEH
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Abstract
A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.
Claims13
A surface-modified aluminum alloy substrate structure, comprising:
- a 6000-Series aluminum alloy substrate;
- a diffusion buffer layer formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer;
- and
- a meltable metallic layer formed on the diffusion buffer layer for being melted in a subsequent process.
A surface-modified aluminum alloy substrate structure, comprising:
- a 6000-Series aluminum alloy substrate;
- a diffusion buffer layer formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer;
- a meltable metallic layer formed on the diffusion buffer layer for being melted in a subsequent process;
- and
- a brazing promotion layer formed on the meltable metallic layer for enhancing a eutectic reaction.
Dependencies are inferred from the claim text.