# US 2025/0205379 A1 · Micro-leds configured for operation at wavelengths in the far-uvc spectrum

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- Number: US 2025/0205379 A1
- Document ID: US20250205379A1
- Status: Published application
- Kind: A1
- Application number: 18/844,525
- Filed: 2023-03-15
- Published: 2025-06-26
- Earliest claimed: 2022-03-16
- Assignees: Uviquity, Inc.
- Applicants: Uviquity, Inc.
- Inventors: Brent Fisher; Scott Burroughs
- Web page: https://patentgrep.com/patent/US20250205379A1

## CPC

- H10H 20/819: characterised by their shape, e.g. curved or truncated substrates
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- A61L 2/10: Ultraviolet [UV] radiation
- A61L 9/20: Ultraviolet radiation
- A61L 2202/11: Apparatus for generating biocidal substances, e.g. vaporisers, UV lamps
- A61L 2209/12: Lighting means
- H10H 20/018: {Bonding of wafers}
- H10H 20/856: Reflecting means
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- A61L: METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES (preservation of bodies or disinfecting characterised by the agents employed A01N; preserving, e.g. sterilising, food or foodstuffs A23; preparations for medical, dental or toiletry purposes A61K)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting diode (LED) includes a semiconductor structure comprising at least one epitaxial layer that is configured to generate far-UVC light, and respective electrical contacts on first and second surfaces of the semiconductor structure. One or more dimensions of the at least one epitaxial layer in a lateral direction are within an order of magnitude of a thickness of the at least one epitaxial layer in a vertical direction. A primary light extraction surface may include at least one sidewall of the semiconductor structure that extends between the first and second surfaces and is configured to emit the far-UVC light. Related devices, arrays thereof, and fabrication methods are also discussed.

## Claims

### Claim 1

A light emitting diode (LED), comprising:
a semiconductor structure comprising at least one epitaxial layer that is configured to generate far-UVC light,
wherein one or more dimensions of the at least one epitaxial layer in a lateral direction are within an order of magnitude of a thickness of the at least one epitaxial layer in a vertical direction.

### Claim 2 (depends on 1)

The LED of claim 1, wherein the semiconductor structure comprises:
first and second surfaces having respective electrical contacts thereon; and
at least one sidewall that extends between the first and second surfaces and is configured to emit the far-UVC light.

### Claim 3 (depends on 2)

The LED of claim 2, wherein the at least one sidewall comprises opposing sidewalls of the at least one epitaxial layer that extend between the first and second surfaces, and the one or more dimensions comprise a distance between the opposing sidewalls.

### Claim 4 (depends on 2)

The LED of claim 2, wherein the at least one sidewall is configured to direct the far-UVC light into a beam or into a distributed pattern.

### Claim 5 (depends on 2)

The LED of claim 2, wherein the at least one sidewall is inclined between the first and second surfaces.

### Claim 6 (depends on 2)

The LED of claim 2, wherein at least one of the respective electrical contacts is at least partially opaque to the far-UVC light.

### Claim 7 (depends on 1)

The LED of claim 1, further comprising:
a substrate including the semiconductor structure on a front surface thereof, wherein the substrate is different than a native substrate on which the semiconductor structure is formed.

### Claim 8 (depends on 7)

The LED of claim 7, wherein the substrate comprises one or more optical redirection structures facing the at least one sidewall of the semiconductor structure and configured to alter a propagation direction of the far-UVC light emitted therefrom into one or more directions.

### Claim 9 (depends on 8)

The LED of claim 8, wherein the one or more optical redirection structures are attached to the front surface of the substrate adjacent the semiconductor structure.

### Claim 10 (depends on 8)

The LED of claim 8, wherein the one or more optical redirection structures are integral to the substrate, and the surface of the substrate including the semiconductor structure thereon is recessed relative to the one or more optical redirection structures.

### Claim 11 (depends on 8)

The LED of claim 8, wherein the substrate comprises:
a back surface opposite the front surface and having a backside contact thereon; and
at least one conductive through via that extends through the substrate and electrically connects at least one of the respective electrical contacts of the semiconductor structure to the backside contact.

### Claim 12 (depends on 1)

The LED of claim 1, wherein the LED is free of a native substrate of the semiconductor structure.

### Claim 13 (depends on 1)

The LED of claim 1, wherein the semiconductor structure is further configured to generate UVC light.

### Claim 14

A light emitting diode (LED), comprising:
a semiconductor structure that is configured to generate far-UVC light, the semiconductor structure comprising first and second surfaces;
respective electrical contacts on at least one of the first and second surfaces; and
a primary light extraction surface comprising at least one sidewall of the semiconductor structure that extends between the first and second surfaces and is configured to emit the far-UVC light.

### Claim 14 (depends on 14)

The LED of claim 14, wherein the at least one sidewall is inclined between the first and second surfaces.

### Claim 15 (depends on 14)

The LED of claim 14, wherein the at least one sidewall comprises opposing sidewalls of one or more epitaxial layers of the semiconductor structure that extend between the first and second surfaces, and a distance between the opposing sidewalls is less than about 100 microns.

### Claim 16 (depends on 15)

The LED of claim 15, wherein the distance between the opposing sidewalls is less than about 50 μm.

### Claim 17 (depends on 15)

The LED of claim 15, wherein a thickness of the one or more epitaxial layers of the semiconductor structure is about 10 μm or less.

### Claim 18 (depends on 15)

The LED of claim 15, wherein the distance between the opposing sidewalls is within an order of magnitude of the thickness of the one or more epitaxial layers of the semiconductor structure.

### Claim 20 (depends on 14)

The LED of claim 14, wherein at least one of the respective electrical contacts is at least partially opaque to the far-UVC light.

### Claim at position 21

-27. (canceled)

### Claim 28

A light emitting diode (LED), comprising:
a semiconductor structure that is configured to generate light comprising a wavelength in a far-UVC wavelength range, the semiconductor structure comprising first and second surfaces having respective electrical contacts thereon and one or more lateral surfaces extending between the first and second surfaces,
wherein a collective surface area of the one or more lateral surfaces is within a factor of 10 of a respective surface area of the top or bottom surface.

### Claim at position 23

-36. (canceled)