Sinter ready multilayer wire/ribbon bond pads and method for die top attachment
OwnerMatthew SIEBENHUHNER, Bin MO +5inventors
InventorsMatthew SIEBENHUHNER, Bin MO, Monnir BOUREGHDA, Maurizio FENECH, Bogdan BANKIEWICZ, Oscar KHASELEV, Bawa SINGH
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Abstract
A method of manufacturing a bond pad for connecting a die to a copper ribbon or copper wire on a printed circuit board, the method comprising: providing a sheet of copper foil having a first major surface opposite a second major surface; providing a sinterable film of metal particles; forming a laminated sheet by laminating the first major surface with the sinterable film; and punching a bond pad from the laminated sheet.
Claims21
1-73. (canceled)
A method of manufacturing a bond pad for connecting a die to a copper ribbon or copper wire, the method comprising:
- providing a sheet of copper foil having a first major surface opposite a second major surface;
- providing a sinterable film of metal particles;
- forming a laminated sheet by laminating the first major surface with the sinterable film;
- and
- punching a bond pad from the laminated sheet.
A sinterable silver film comprising:
- silver particles having a longest dimension of from 1 to 1000 nm,
- a polymer binder, and
- a halogenated alcohol activator having a melting point of from 80 to 150° C.
Dependencies are inferred from the claim text.