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US 2025/0201596 A1Published application
Spot heating by moving a beam with horizontal rotary motion
AssigneeApplied Materials, Inc.
InventorsShu-Kwan Danny LAU, Toshiyuki NAKAGAWA, Zhiyuan YE
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Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.
Claims20
A method for spot heating, comprising:
- disposing a substrate on a substrate support in a process chamber;
- activating a radiant spot heating source mounted on a rotary stage to project radiant energy to the substrate;
- moving the radiant spot heating source to direct the projected radiant energy in a sweeping motion at last partially along an arcuate path on the substrate;
- and
- heating a desired area of the substrate with the projected radiant energy.
2 more elements
A process chamber, comprising:
- a first window;
- a substrate support disposed proximate the first window, the substrate support configured to support a substrate;
- a rotary stage disposed in a first plane;
- and
- a radiant spot heating source mounted to the rotary stage and configured to provide radiant energy through the first window toward the substrate support, the radiant spot heating source configured to direct the radiant energy to the substrate supported on the substrate support in a sweeping motion at least partially along an arcuate path, the arcuate path extending from a center of the substrate to a circumference of the substrate.
2 more elements
Dependencies are inferred from the claim text.