Microelectromechanical device

Method for producing a microelectromechanical device comprising a carrier substrate and a plurality of microelectromechanical system (MEMS) modules, wherein each of the MEMS modules comprises an application specific integrated circuit (ASIC) layer comprising at least one ASIC having an ASIC layer front side and an ASIC layer rear side, a baseplate having a baseplate front side and a baseplate rear side, and a plurality of microelectromechanical components, wherein the baseplate is arranged on the ASIC layer front side and the baseplate rear side is connected to the ASIC layer front side, said method comprising:

• a. providing a MEMS substrate having structures for the microelectromechanical components and for the baseplates of the plurality of MEMS modules;
• b. providing an ASIC substrate having structures for the ASIC layers of the plurality of MEMS modules;
• c. producing a coupled substrate by cohesively connecting the MEMS substrate to the ASIC substrate, wherein a plurality of assigned electrical contacts and at least one assigned protective frame between the MEMS substrate and the ASIC substrate are formed for each of the plurality of MEMS modules, such that for each of the MEMS modules the at least one protective frame assigned to the MEMS module at least partly encompasses the electrical contacts assigned to the MEMS module;
• d. singulating the coupled substrate along predefined separating lines to obtain the plurality of MEMS modules;
• e. providing the carrier substrate;
• f. placing the plurality of MEMS modules on a substrate surface of the carrier substrate;
• and
• g. cohesively connecting the ASIC layer rear sides of the plurality of MEMS modules to the substrate surface.