Positive photosensitive resin composition, cured product of the same, and display device including the same
AssigneeToray Industries, Inc.
InventorsSusumu TANAKA, Tomoyuki YUBA, Mitsuhito SUWA
Life of this patent
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Abstract
A positive photosensitive resin composition may include (a) polysiloxane, and (b) a naphthoquinone diazide compound represented by formula (1): (in the formula (1), R1 is an alkyl group having 1 to 8 carbon atoms; Q is a naphthoquinone diazide sulfonyl group represented by the structure shown below or a hydrogen atom, and at least one of all Qs in the formula (1) is a naphthoquinone diazide sulfonyl group: n is an integer of 0 to 4; m is an integer of 4 to 8; and X is a tetravalent to octavalent organic group having 4 to 30 carbon atoms) (in the above structure, * represents a binding site).
Claims13
A positive photosensitive resin composition comprising:
- (a) polysiloxane (hereinafter referred to as “component (a)”), and
- (b) a naphthoquinone diazide compound represented by formula (1) (hereinafter referred to as “component (b)”):
- (in the formula (1), R1 is an alkyl group having 1 to 8 carbon atoms;
- Q is a naphthoquinone diazide sulfonyl group represented by the structure shown below or a hydrogen atom, and at least one of all Qs in the formula (1) is a naphthoquinone diazide sulfonyl group:
- n is an integer of 0 to 4;
- m is an integer of 4 to 8;
- and
- X is a tetravalent to octavalent organic group having 4 to 30 carbon atoms)
- (in the above structure, * represents a binding site).
Dependencies are inferred from the claim text.