Optoelectronic package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJr-Wei LIN, Mei-Ju LU
Life of this patent
Estimating the term…
Abstract
An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.
Claims20
An optoelectronic package, comprising:
- a photonic integrated circuit (PIC) comprising a waveguide;
- an optical component configured to transmit optical signals and optically coupled with the PIC;
- and
- a first element between the PIC and the optical component, wherein the first element comprises a metasurface structure configured to guide the optical signals to be transceived between the PIC and the optical component.
An optoelectronic package, comprising:
- a photonic integrated circuit (PIC) comprising an optical transmission portion;
- an optical component configured to transmit an optical signal to or receive the optical signal from the optical transmission portion;
- and
- an element configured to reshape the optical signal and comprising a first structure portion supported by the optical transmission portion, wherein the first structure portion comprises an extension disposed over the optical transmission portion of the PIC.
An optoelectronic package, comprising:
- a photonic integrated circuit (PIC) comprising a substrate and an optical transmission portion disposed over an upper surface of the substrate;
- an optical component configured to transmit an optical signal to or receive the optical signal from the optical transmission portion;
- and
- an element configured to guide the optical signal to be transceived between the PIC and the optical component, wherein the element comprises a first structure portion supported by the optical transmission portion, and the first structure portion is spaced apart from the upper surface of the substrate.
Dependencies are inferred from the claim text.