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US 2025/0197987 A1Published application
Molybdenum sputtering target assembly and method of making
AssigneeHoneywell International Inc.
InventorsXiaodan Wu, Jaeyeon Kim, Susan D. Strothers, Rashmi Mohanty, Alicia Im
Life of this patent
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Abstract
A molybdenum sputtering target assembly includes molybdenum sputtering target diffusion bonded directly to a molybdenum backing plate. The molybdenum sputtering target consists of molybdenum and the molybdenum backing plate consists of molybdenum or a molybdenum alloy.
Claims13
A molybdenum sputtering target assembly comprising:
- a molybdenum sputtering target consisting of molybdenum;
- and
- a molybdenum backing plate consisting of molybdenum or a molybdenum alloy and diffusion bonded directly to the molybdenum sputtering target.
A method for forming a sputtering target assembly, the method comprising:
- diffusion bonding a molybdenum sputtering target directly to a molybdenum backing plate by hot isostatic pressing at a pressure equal to or greater than 15 ksi and a temperature of from about 700° C. and about 1500° C., wherein the molybdenum sputtering target consists of molybdenum and the molybdenum backing plate consists of molybdenum or a molybdenum alloy.
Dependencies are inferred from the claim text.