Hollow particles and method for producing hollow particles
AssigneeZeon Corporation
InventorsTakeru Chiba, Sakyo Yagyu
Life of this patent
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Abstract
To provide hollow particles which are, as a filler for electronic materials, excellent in balance between pressure resistance, dielectric property and thermal expansion coefficient. Hollow particles comprising a shell and a hollow portion surrounded by the shell, wherein a void ratio is 50% or more; wherein a volume average particle diameter is 1.0 μm or more and 50.0 μm or less; and wherein the shell contains an organic-inorganic composite material containing a resin and inorganic fine particles, and a content of the inorganic fine particles in the shell is 20% by mass or more and 90% by mass or less.
Claims10
Hollow particles comprising a shell and a hollow portion surrounded by the shell,
- wherein a void ratio is 50% or more;
- wherein a volume average particle diameter of the hollow particles is 1.0 μm or more and 50.0 μm or less;
- and
- wherein the shell contains an organic-inorganic composite material containing a resin and inorganic fine particles, and a content of the inorganic fine particles in the shell is 20% by mass or more and 90% by mass or less.
Dependencies are inferred from the claim text.