Encapsulant Film Composition and Encapsulant Film Including the Same

Abstract

The encapsulant film composition includes an ethylene/alpha-olefin copolymer and porous silica and has excellent compatibility with a crosslinking additive. The encapsulant film composition has a ratio of an Si—O band integral value to a C—H band integral value of from 3 to 70. When an encapsulant film is produced using the encapsulant film composition, the impregnation time of an ethylene/alpha-olefin copolymer is reduced so that the economic viability of a process of producing an encapsulant film can be improved. Moreover, by delaying the transfer of the crosslinking agent, it is possible to suppress a slip phenomenon of the encapsulant film. The present disclosure also relates to a solar cell module.

Dependencies are inferred from the claim text.