Compound, curable resin composition, cured product, and decomposition method

Abstract

A compound represented by a general formula (1) in which R1 represents a divalent or higher organic group, R2 represents a hydrogen atom or an alkyl group, R3 represents a monovalent organic group including a reactive functional group, and n represents an integer of 2 to 10. The reactive functional group in R3 may be at least one selected from the group consisting of a glycidyl group, a (meth)acryloyl group, an epoxycyclohexyl group, an oxetanyl group, an allyl group, and a vinyl group.

Dependencies are inferred from the claim text.