Silica particles, production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device

Abstract

Silica particles have an average pore volume of nanoscale pores of 5.3 nm3 or less as measured by positron annihilation spectroscopy. The silica particles may have an average pore volume of atomic-scale pores of 0.33 nm3 or more as measured by positron annihilation spectroscopy. The silica particles may have a volume of pores having a diameter of 2 nm or less of 0.0070 cm3/g or less as measured by a nitrogen gas adsorption method.

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