Laser processing path laying-out method, laser processing method, and laser processing path laying-out device

The laser processing path laying-out device comprising:

• a central processing unit;
• and
• a storage unit having stored therein a laser processing path laying-out program for laying out, to nesting data in which a shape of a product including a notch at an outer peripheral end portion thereof is disposed in a shape indicating a workpiece, a laser processing path for cutting out the product from the workpiece by laser processing, wherein
• the central processing unit is configured to execute the laser processing path laying-out program to:
• lay out, within the laser processing path, to a part of the notch of the nesting data, as a partial processing path in a notch formation processing path for forming the notch, an open path for cutting to an inner side of the product, excluding a line segment of the part of the notch in the outer peripheral end portion, the open path opening toward an outer side of the product;
• and
• lay out, to the nesting data, within the laser processing path, an outer peripheral path obtained by coupling a first outer peripheral processing path and a second outer peripheral processing path, the first outer peripheral processing path being provided for cutting the line segment of the part of the notch in the outer peripheral end portion, which is a remaining partial processing path in the notch formation processing path, the second outer peripheral processing path being provided for cutting at least a part of a line segment other than the part of the notch in the outer peripheral end portion.