Substrate stage inspection method and semiconductor device manufacturing method including the same

A substrate stage inspection and control method comprising:

• receiving data about a bonding process of bonding a semiconductor chip on a printed circuit board (PCB);
• calculating a plane equation for a substrate stage where the PCB is placed, by using at least three points of a work area of a first nozzle from among all nozzles of a bond head;
• correcting an initial touch height of a location to be corrected to a first touch height, by using the plane equation;
• determining whether a particle is present on the substrate stage by comparing the first touch height with a set first reference touch height;
• inspecting tilt abnormality of the substrate stage by using the work area of the first nozzle;
• and
• determining whether the calculating of the plane equation to the inspecting of the tilt abnormality have been performed for the all nozzles,
• wherein, upon determining that the calculating of the plane equation to the inspecting of the tilt abnormality has not been performed for the all nozzles, the calculating of the plane equation to the inspecting of the tilt abnormality is repeated for a nozzle for which the calculating of the plane equation to the inspecting of the tilt abnormality are not performed.

A semiconductor device manufacturing method comprising:

• inspecting a substrate stage;
• controlling the substrate stage according to a result of the inspecting;
• and
• performing a semiconductor process by arranging a substrate on the substrate stage, wherein the inspecting of the substrate stage comprises,
• receiving data about the semiconductor process from a database (DB),
• calculating a tilt of the substrate stage by using the data,
• adjusting the data such that an effect of the tilt is reduced,
• detecting a particle on the substrate stage, based on the adjusted data, and
• inspecting tilt abnormality of the substrate stage.