Surface structure of an electrostatic chuck and method for forming the same

Abstract

The present invention relates to the surface structure of an electrostatic chuck used in semiconductor manufacturing processes. The surface structure comprises a substrate, a first protective coating disposed on the substrate, and a second protective coating disposed on the first protective coating. The first protective coating is deposited on the substrate and is made from materials selected from groups comprising metal oxides, fluorides, and nitrides. It serves as a universal protective barrier against wear, corrosion, and thermal effects. The second protective coating, which is deposited on the first protective coating, possesses a higher hardness than the first protective coating, thereby providing enhanced wear resistance. Additionally, the present invention offers a versatile and effective solution for improving the performance and lifespan of electrostatic chucks in semiconductor manufacturing.

Dependencies are inferred from the claim text.