Transistor outline package and production method thereof, optical sub-assembly, optical module, and optical communication system

A production method for a transistor outline package, wherein the transistor outline package comprises:

• a transistor base;
• a transistor cap disposed on the transistor base, wherein the transistor cap and the transistor base form an accommodation cavity;
• a main lens disposed on a top of the transistor cap, running through the transistor cap, and configured to transmit all light rays, wherein the all light rays comprise a first light ray and a second light ray;
• a first chip disposed in the accommodation cavity, wherein the first light ray is transmitted between the first chip and the main lens, and the first chip is an optical transmitter chip;
• a second chip disposed in the accommodation cavity, wherein the second light ray is transmitted between the second chip and the main lens;
• and
• an optical splitting component disposed between the first chip and the main lens and configured to adjust a transmission direction of the first light ray, wherein the optical splitting component is further disposed between the second chip and the main lens and is configured to adjust a transmission direction of the second light ray;
• and
• wherein the method comprises:
• fastening the optical splitting component to the transistor base;
• presetting the first chip and the second chip on the transistor base;
• adjusting a position of the first chip based on a flare of the first light ray or an optical power of the first light ray;
• fastening the first chip when the flare of the first light ray is located at a first preset position or the optical power of the first light ray reaches a first preset optical power;
• adjusting a position of the second chip based on a flare of the second light ray or an optical power of the second light ray;
• fastening the second chip when the flare of the second light ray is located at a second preset position or the optical power of the second light ray reaches a second preset power;
• and
• mounting the transistor cap on the transistor base.

An optical sub-assembly, comprising a transistor and at least one transistor outline package, wherein the at least one transistor outline package comprises:

• a transistor base;
• a transistor cap disposed on the transistor base, wherein the transistor cap and the transistor base form an accommodation cavity:
• a main lens disposed on a top of the transistor cap, running through the transistor cap, and configured to transmit all light rays, wherein the all light rays comprise a first light ray and a second light ray;
• a first chip disposed in the accommodation cavity, wherein the first light ray is transmitted between the first chip and the main lens, and the first chip is an optical transmitter chip;
• a second chip disposed in the accommodation cavity, wherein the second light ray is transmitted between the second chip and the main lens;
• and
• an optical splitting component disposed between the first chip and the main lens and configured to adjust a transmission direction of the first light ray, wherein the optical splitting component is further disposed between the second chip and the main lens and is configured to adjust a transmission direction of the second light ray;
• and
• wherein the transistor has an inner cavity, the inner cavity is configured to transmit a total light ray, the transistor outline package is mounted on the transistor, and the main lens transmits the total light ray towards the inner cavity.

An optical device, comprising an outline and an optical sub-assembly, wherein:

• the optical sub-assembly is mounted on the outline, the outline has an optical fiber port, and the optical fiber port is configured to connect to an optical fiber;
• and
• the optical sub-assembly comprises a transistor and at least one transistor outline package, wherein the at least one transistor outline package comprises:
• a transistor base;
• a transistor cap disposed on the transistor base, wherein the transistor cap and the transistor base form an accommodation cavity;
• a main lens disposed on a top of the transistor cap, running through the transistor cap, and configured to transmit all light rays, wherein the all light rays comprise a first light ray and a second light ray;
• a first chip disposed in the accommodation cavity, wherein the first light ray is transmitted between the first chip and the main lens, and the first chip is an optical transmitter chip;
• a second chip disposed in the accommodation cavity, wherein the second light ray is transmitted between the second chip and the main lens;
• and
• an optical splitting component disposed between the first chip and the main lens and configured to adjust a transmission direction of the first light ray, wherein the optical splitting component is further disposed between the second chip and the main lens and is configured to adjust a transmission direction of the second light ray;
• and
• wherein the transistor has an inner cavity, the inner cavity is configured to transmit a total light ray, the transistor outline package is mounted on the transistor, and the main lens transmits the total light ray towards the inner cavity.