Micro-assembler system with micro-object trap locations

A micro-assembler apparatus, comprising:

• a micro-assembler backplane location configured to hold a micro-assembler backplane arrangement, where the micro-assembler backplane arrangement comprises:
• a micro-assembler backplane having a first surface;
• a plurality of controlled electrodes arranged in proximity to the first surface to manipulate micro-objects on the micro-assembler backplane;
• and
• at least one trap location, separate from the plurality of controlled electrodes, the at least one trap location configured to hold, independently of activation of the plurality of controlled electrodes, at least one micro-object that is manipulated into a respective trap location within the at least one trap location;
• a micro-object location sensor configured to capture an image of a side of the micro-assembler backplane onto which micro-objects are placed;
• an electrode controller configured to, when operating, control which controlled electrodes are activated;
• a controller that is configured to, when operating:
• receive images from the micro-object location sensor, wherein the images comprise images of micro-objects on the first surface of the micro-assembler backplane;
• determine a next controlled electrode pattern to create an electric field across the first surface of the micro-assembler backplane to manipulate at least one of a respective position or respective orientation of at least one micro-object on the first surface of the micro-assembler backplane;
• and
• control the electrode controller to activate controlled electrodes according the next controlled electrode pattern.

A method for assembling products containing micro-objects, the method comprising:

• placing, on a surface of a micro-assembler backplane arrangement, a plurality of micro-objects, wherein the micro-assembler backplane arrangement comprises a plurality of controlled electrodes arranged in proximity to a surface of the micro-assembler backplane arrangement;
• and at least one trap location, separate from the plurality of controlled electrodes, the at least one trap location configured to hold, independently of activation of the controlled electrodes, at least one micro-object that is manipulated into a respective trap location within the at least one trap location;
• receiving an image of the surface of the micro-assembler backplane arrangement, the image comprising images of the plurality of micro-objects;
• determining, based on processing of the image, manipulations to be made to at least one of a respective location and a respective orientation of at least one micro-object in the plurality of micro-objects;
• controlling the controlled electrodes to activate controlled electrodes on the micro-assembler backplane to create electric fields to perform the manipulations;
• and
• causing, based on the manipulations, a respective micro-object to be held in a respective trap location on the micro-assembler backplane.