Electronic device comprising conductive layer
AssigneeSamsung Electronics Co., Ltd.
InventorsTaehoon KANG, Hyuksu KIM, Jinyoung PARK
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Abstract
An electronic device comprising a conductive layer is disclosed. The electronic device according to various embodiments may comprise: a printed circuit board in which at least one electrical element and a plurality of wirings connected to the electrical element are arranged on a first surface facing a first direction; a wiring exposure part in which at least one from among the plurality of wirings is exposed on a lateral surface, the lateral surface being the surface facing the direction perpendicular to the first direction of the printed circuit board; and a conductive layer in electrical contact with the wiring exposure part.
Claims20
An electronic device comprising:
- a printed circuit board wherein at least one electrical component and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction;
- a wiring exposure part in which at least one from among the plurality of wirings is exposed on a lateral surface of the printed circuit board, the lateral surface being a surface facing a direction perpendicular to the first direction;
- and
- a conductive layer in electrical contact with the wiring exposure part.
A substrate part of an electronic device including a plurality of electrical components, the substrate part comprising:
- a printed circuit board wherein at least one of the electrical components and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction;
- a wiring exposure part wherein at least one from among the plurality of wirings is exposed on a lateral surface of the printed circuit board, the lateral surface being a surface facing a direction perpendicular to the first direction;
- and
- a conductive layer in electrical contact with the wiring exposure part.
An electronic device comprising:
- a printed circuit board wherein at least one electrical component and a plurality of wirings connected to the electrical component are arranged on a first surface facing a first direction;
- a wiring exposure part in which at least one from among the plurality of wirings is exposed on a lateral surface of the printed circuit board, the lateral surface being a surface facing a direction perpendicular to the first direction;
- a molding part comprising a molded non-conductive material disposed to cover at least in part the first surface of the printed circuit board and the electrical components arranged on the first surface;
- and
- conductive layer formed on at least a portion of surfaces of the molding part and the lateral surface of the printed circuit board, and in electrical contact with the wiring exposure part.
Dependencies are inferred from the claim text.