Ic chip mounting apparatus and ic chip mounting method

Abstract

An embodiment of the present invention is an IC chip mounting apparatus comprising: a conveyor configured to convey an antenna continuous body, the antenna continuous body having a base material and a plurality of inlay antennas continuously formed on the base material; an IC placement unit configured to place an IC chip on an adhesive, the adhesive being provided at a reference position of each of the antennas of the antenna continuous body; and a unit attachment configured to replaceably attach a light curing unit and a thermal curing unit, the light curing unit curing the adhesive by irradiating the adhesive with light, while pressing the IC chip placed on the adhesive toward an antenna side, the thermal curing unit curing the adhesive by heating the adhesive, while pressing the IC chip placed on the adhesive toward an antenna side.

Dependencies are inferred from the claim text.