Substrate processing apparatus, fluid supply system, and substrate processing method
AssigneeTokyo Electron Limited
InventorsTakahiro HAYASHIDA, Mikio NAKASHIMA, Shigeru MORIYAMA
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AssigneeTokyo Electron Limited
InventorsTakahiro HAYASHIDA, Mikio NAKASHIMA, Shigeru MORIYAMA
Estimating the term…
A substrate processing apparatus includes a processing chamber configured to accommodate a substrate; a supply flow path configured to supply a processing fluid into the processing chamber; a heating mechanism configured to heat the processing fluid flowing through the supply flow path; a first temperature sensor configured to detect a temperature of the processing fluid downstream of the heating mechanism; a pressure sensor configured to detect a pressure of the processing fluid downstream of the heating mechanism; and a controller. The controller controls an output of the heating mechanism based on the pressure of the processing fluid detected by the pressure sensor and the temperature of the processing fluid detected by the first temperature sensor.
A substrate processing apparatus comprising:
A fluid supply system comprising:
A substrate processing method using a substrate processing apparatus including:
Dependencies are inferred from the claim text.