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US 2025/0178884 A1Published application
Mems cantilever-enclosure spacing
AssigneeSoundskrit Inc.
InventorsYuhai Mei, Alena Gracheva, Mohamed El Badawe, Carly Stalder
Life of this patent
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Abstract
A microphone device includes a substrate, a microelectromechanical system (MEMS) transducer supported by the substrate, the MEMS transducer including a cantilever, the cantilever having a length, and an enclosure structure that encapsulates the MEMS transducer. A spacing between the cantilever and the enclosure structure is greater than the length of the MEMS transducer.
Claims15
A microphone device comprising:
- a substrate;
- a microelectromechanical system (MEMS) transducer supported by the substrate, the MEMS transducer comprising a cantilever, the cantilever having a length;
- and
- an enclosure structure that encapsulates the MEMS transducer;
- wherein a spacing between the cantilever and the enclosure structure is greater than the length of the cantilever.
2 more elements
A microphone device comprising:
- a substrate;
- a microelectromechanical system (MEMS) transducer supported by the substrate, the MEMS transducer comprising a cantilever, the cantilever having a length;
- and
- a lid that encapsulates the MEMS transducer;
- wherein:
- the cantilever is spaced apart from the lid by a distance;
- and
- the distance is greater than the length of the cantilever.
5 more elements
A microphone device comprising:
- a substrate;
- a microelectromechanical system (MEMS) transducer supported by the substrate, the MEMS transducer comprising a cantilever, the cantilever having a length;
- and
- a lid that encapsulates the MEMS transducer;
- wherein a clearance between the cantilever and the lid is greater than the length of the MEMS transducer.
2 more elements
Dependencies are inferred from the claim text.