Systems and methods of controlling adhesive application

Abstract

A method and system for controlling and providing a more consistent material application amount includes implementing a conveyor configured to convey substrates along a dispense line at a speed; implementing an application device configured to apply a desired amount of a material to each of the substrates; implementing a pump configured to deliver the material at a pressure to the application device; implementing a controller configured to receive a desired speed of the conveyor and control a speed of the conveyor to convey the substrates along the dispense line at the desired speed; determining with the controller a target pressure of the material provided by the pump to the application device to provide the desired amount of the material to each of the substrates utilizing a control algorithm; measuring an amount of material applied to a plurality of substrates by a pump; comparing the material applied per substrate to a target value; and adjusting a pressure of the pump based on the comparing the material applied per substrate to a target value.

Dependencies are inferred from the claim text.