System and Method for Aligning Bonding Pads with Bonding Locations using Moiré Patterns
AssigneeCanon Kabushiki Kaisha
InventorsDwayne L. LaBrake, Niyaz Khusnatdinov
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Abstract
A system and method for holding a chip on a chip chuck. The chip has a set of interconnect contacts. The system and method includes positioning a first grating relative to the set of interconnect contacts. The system and method includes measuring a first moiré pattern of the first grating and the set of interconnect contacts. The system and method includes adjusting position of the chip chuck relative to a substrate chuck based on the first moiré pattern.
Claims20
A method comprising:
- holding a chip on a chip chuck, wherein the chip has a set of interconnect contacts;
- positioning a first grating relative to the set of interconnect contacts;
- measuring a first moiré pattern of the first grating and the set of interconnect contacts;
- and
- adjusting position of the chip chuck relative to a substrate chuck based on the first moiré pattern.
A bonding system controller, wherein the bonding system controller is adapted to:
- send instructions to a chip chuck to hold a chip, wherein the chip has a set of interconnect pads;
- send instructions to a grating positioning system configured to position a first grating relative to the set of interconnect contacts;
- receive a first moiré pattern of the first grating and the set of interconnect contacts from a measurement system;
- and
- send instruction of a chip chuck positioning system configured to adjust the position of the chip chuck relative to the wafer chuck based on the first moiré pattern.
A bonding system for bonding a chip that has a set of interconnect contacts to a substrate comprising:
- a chip chuck configured to hold the chip;
- a wafer chuck configured to hold the substrate;
- a grating positioning system configured to position a first grating relative to the set of interconnect contacts;
- a measuring system configured to measure a first moiré pattern of the first grating and the set of interconnect contacts;
- and
- a chip chuck positioning system configured to adjust the position of the chip chuck relative to the wafer chuck.
The bonding system further comprising:
- a measurement positioning system configured to adjust positions of one or both of an illumination system and a measurement system based on arrangement information of the set of interconnect contacts.
Dependencies are inferred from the claim text.