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AssigneeToray Industries, Inc.
InventorsYusuke KOMORI, Hiroki NISHIOKA
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The present invention relates to a photosensitive resin composition that has high sensitivity, and can form a film having low transmittance after curing regardless of the heating atmosphere during curing. The photosensitive resin composition of the present invention contains an alkali-soluble resin (a); an aromatic hydrocarbon (b) having at least one aromatic C—H bond and at least three phenolic hydroxyl groups in one aromatic ring; a thermal cross-linking agent (c) having a partial structure represented by the formula (1); and a photosensitive compound (e). In the formula (1), R10 represents a hydrogen atom or an alkyl group, each * represents a bond, and a carbonyl group is not adjacent to a nitrogen atom.
A photosensitive resin composition comprising:
A cured article comprising a crosslinked body of 1,2,4-trihydroxybenzene or pyrogallol and a thermal cross-linking agent (c) having a partial structure represented by a formula (1):
A cured article formed on a support, wherein the cured article has a normalized secondary ion intensity of 137C7H5O3− of 1.0×10−4 or more as measured by time-of-flight secondary ion mass spectrometry under measurement conditions that cutting is performed by an Ar gas cluster ion beam method in a direction from a surface of the cured article toward the support, a primary ion species is Bi3++, a primary ion current is 0.1 pA, and an irradiation region of the primary ion is a region inside a quadrangle having a side length of 200 μm.
Dependencies are inferred from the claim text.