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US 2025/0172869 A1Published application
Wafer end protective-film forming composition for semiconductor manufacturing
AssigneeNissan Chemical Corporation
InventorsShunsuke MORIYA, Takahiro KISHIOKA
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Abstract
A wafer end protective-film forming composition for semiconductor manufacturing including: a polymer or compound having a crosslinkable group, and a solvent, wherein the solvent contains a first solvent and a second solvent, and when an evaporation rate of n-butyl acetate is 1, an evaporation rate of the first solvent is 0.10 or more and an evaporation rate of the second solvent is 0.05 or less.
Claims25
A wafer end protective-film forming composition for semiconductor manufacturing, comprising:
- a polymer or compound having a crosslinkable group, and
- a solvent,
- wherein the solvent contains a first solvent and a second solvent, and
- when an evaporation rate of n-butyl acetate is 1, an evaporation rate of the first solvent is 0.10 or more and an evaporation rate of the second solvent is 0.05 or less.
1 more element
Dependencies are inferred from the claim text.