Supporting plate, manufacturing method thereof and substrate processing device having the same
AssigneeSemes Co., Ltd.
InventorsJaeoh BANG, Seunghwan LEE, Gilsoo EUN, Sunwoon KIM
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AssigneeSemes Co., Ltd.
InventorsJaeoh BANG, Seunghwan LEE, Gilsoo EUN, Sunwoon KIM
Estimating the term…
It is disclosed that a support plate configured to enable the flow of ions during electroless plating or electrolytic plating to allow surface treatment on an inner flow path, a method of manufacturing the support plate and a substrate processing device having the support plate. A support plate includes an upper plate, a lower plate, and a stopper member. The lower plate has a formed inner flow path, disposed to face the upper plate, and has a plurality of penetration holes formed corresponding to each of the inflection points of the inner flow path. The stopper member is inserted into the penetration hole in a state in which the upper plate and the lower plate are bonded to each other. Therefore, by forming a separate penetration hole in a structure in which coating or plating of the inner flow path is not possible, the flow of ions during electroless plating or electrolytic plating is possible and surface treatment is possible.
A support plate comprising:
A method of manufacturing a support plate, the method comprising:
A substrate processing device comprising:
Dependencies are inferred from the claim text.