# US 2025/0169017 A1 · Chassis architecture and server comprising same

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- Number: US 2025/0169017 A1
- Document ID: US20250169017A1
- Status: Published application
- Kind: A1
- Application number: 18/873,670
- Filed: 2023-08-31
- Published: 2025-05-22
- Earliest claimed: 2023-01-04
- Assignees: Suzhou Metabrain Intelligent Technology Co., Ltd.
- Applicants: Suzhou Metabrain Intelligent Technology Co., Ltd.
- Inventors: Jingxian ZHU; Zhencai CAO; Zhanyang LI; Xiuzhong YIN
- Web page: https://patentgrep.com/patent/US20250169017A1

## CPC

- H05K 7/1488: {Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures}
- G06F 1/183: Internal mounting support structures, e.g. for supporting printed circuit boards
- G06F 1/184: Mounting of motherboards
- G06F 1/185: Mounting of expansion boards
- G06F 1/187: Mounting of fixed or removable disk drives
- G06F 1/188: Mounting of power supply units
- G06F 1/189: {Power distribution}
- G06F 1/20: Cooling means
- H05K 7/1487: {Blade assemblies, e.g. blade cases or inner arrangements within a blade}
- H05K 7/1491: {having cable management arrangements (management of optical cables G02B6/444; in telecommunication cabinets H04Q1/06)}
- H05K 7/20736: {within cabinets for removing heat from server blades}
- Y02D 10/00: Energy efficient computing, e.g. low power processors, power management or thermal management
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- Y02D: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE

## Abstract

A chassis architecture and a server comprising same. The chassis architecture includes: a PCIE module layer, a threading layer and a computing layer. The threading layer is provided with a plurality of first threading holes, allowing a passage of PCIE cables connected to PCIE modules; the upper surface of the threading layer is configured for bearing the PCIE cables; the computing layer is provided with a plurality of second threading holes, allowing a passage of the PCIE cables. Moreover, an upper surface of the threading layer is configured for bearing the PCIE cables, so that a plurality of PCIE modules may be arranged in one row, and thus each of the plurality of PCIE modules may meet the heat dissipation requirement thereof.

## Claims

### Claim 1

A chassis architecture, comprising:
a PCIE (Peripheral Component Interface Express) module layer, comprising a bottom plate and two side plates connected to two sides of the bottom plate, a PCIE module installing area and a fan installing area being respectively provided at two ends of the bottom plate in an extending direction of the bottom plate, and the PCIE module installing area being configured for accommodating a plurality of PCIE modules;
a threading layer, provided above the PCIE module layer and corresponding to the PCIE module installing area, two sides of the threading layer being connected to the two side plates, the threading layer being provided with a plurality of first threading holes, the plurality of first threading holes being configured for allowing a passage of a PCIE cable connected to the plurality of PCIE modules, and an upper surface of the threading layer being configured for bearing the PCIE cable; and
a computing layer, provided above the threading layer, two sides of the computing layer being connected to the two side plates, the computing layer being provided with a mainboard installing area and a power supply installing area, the computing layer being provided with a plurality of second threading holes, and the plurality of second threading holes being configured for allowing the passage of the PCIE cable, so that the PCIE cable extends to the mainboard installing area and/or the power supply installing area.

### Claim 2 (depends on 1)

The chassis structure as claimed in claim 1, wherein the threading layer comprises a fixing tray, the fixing tray is parallel to the bottom plate, and two sides of the fixing tray are connected to the two side plates by clamping.

### Claim 3 (depends on 1)

The chassis architecture as claimed in claim 1, wherein two sides of the fixing tray are provided with L-shaped grooves; the two side plates are provided with I-shaped nails, and the L-shaped grooves are fitted with the I-shaped nails.

### Claim 4 (depends on 1)

The chassis architecture as claimed in claim 1, wherein a fixing tray comprises two first threading holes parallel to each other, and an extending direction of the two first threading holes is perpendicular to the extending direction of the bottom plate.

### Claim 5 (depends on 1)

The chassis architecture as claimed in claim 1, wherein temporary cable storage structures are provided at two sides of each of the plurality of first threading holes, and/or temporary cable storage structures are provided on a fixing tray at a position corresponding to each of the plurality of second threading holes, and the temporary cable storage structures comprise cable clamps.

### Claim 6 (depends on 1)

The chassis architecture as claimed in claim 1, wherein edges of the plurality of first threading holes are provided with flexible seals extending to the central position of the plurality of first threading holes, and gaps between the flexible seals pass through the PCIE cable; and the flexible seals comprise a foam strip, a fur brush, a rubber block or an elastic fabric strip.

### Claim 7 (depends on 1)

The chassis architecture as claimed in claim 1, wherein the PCIE module layer comprises an external outer end plate and an inner end plate that are located at two sides of the PCIE module installing area, bottom edges of the external outer end plate and the inner end plate are both connected to the bottom plate, and two ends of the external outer end plate and two ends of the inner end plate are both connected to the two side plates, a top edge of the external outer end plate is connected to the computing layer, and a top edge of the inner end plate is connected to the threading layer, so that the PCIE module installing area between the threading layer and the bottom plate forms a closed cavity.

### Claim 8 (depends on 1)

The chassis architecture as claimed in claim 1, wherein a plurality of PCIE module fixing slots provided in parallel are provided in the PCIE module installing area, and each of the plurality of PCIE module fixing slots is arranged in an extending direction of the bottom plate and is capable of accommodating each of the plurality of PCIE modules, and all of the plurality of PCIE module fixing slots are aligned with each other in an extending direction perpendicular to the extending direction of the bottom plate.

### Claim 9 (depends on 1)

The chassis architecture as claimed in claim 1, wherein an external outer end plate is provided with connection ports corresponding to each of a plurality of PCIE module fixing slots; each of the connection ports is able to snap-fit a baffle or snap-fit an end blocking plate of each of the plurality of PCIE modules; and an inner end plate is provided with snap-fit ports which are arranged in a one-to-one correspondence with the connection ports.

### Claim 10 (depends on 1)

The chassis architecture as claimed in claim 1, wherein the plurality of PCIE modules comprise an active heat dissipation PCIE card and a passive heat dissipation PCIE card; two ends of each of the plurality of PCIE modules are respectively provided with an end blocking plate and a card tail fixing support;
when the passive heat dissipation PCIE card is provided in a PCIE module fixing slot, a connection port accommodates the end blocking plate of the passive heat dissipation PCIE card;
when no passive heat dissipation PCIE card is provided in a PCIE module fixing slot, a baffle is snap-fitted to a connection port corresponding to the PCIE module fixing slot;
when the active heat dissipation PCIE card is provided in a PCIE module fixing slot, the active heat dissipation PCIE card and a connection port corresponding to the PCIE module fixing slot are arranged at intervals, a baffle is snap-fitted to the connection port, an air inlet hole is provided on the baffle, and a snap-fit port fixes the card tail fixing support of the active heat dissipation PCIE card; and
when no PCIE module is provided in the PCIE module fixing slot, a baffle is snap-fitted to both the connection port and the snap-fit port corresponding to the PCIE module fixing slot.

### Claim 11 (depends on 1)

The chassis architecture as claimed in claim 1, wherein the chassis architecture comprises an air guide hood, and when both an active heat dissipation PCIE card and a passive heat dissipation PCIE card are provided in a PCIE module fixing slot in the PCIE module installing area, the air guide hood is provided between a card tail fixing support of the passive heat dissipation PCIE card and a snap-fit port.

### Claim 12 (depends on 1)

The chassis architecture as claimed in claim 1, wherein two sides of the computing layer are provided with L-shaped grooves, the two side plates are provided with I-shaped nails, and the L-grooves are fitted with the I-shaped nails.

### Claim 13 (depends on 1)

The chassis architecture as claimed in claim 1, wherein the computing layer is provided with an I/O module installing area; the I/O module installing area is located on a side of the mainboard installing area away from the power supply installing area; a second threading hole is provided between the I/O module installing area and the mainboard installing area; and a second threading hole is provided between the mainboard installing area and the power supply installing area.

### Claim 14 (depends on 1)

A server, comprising the chassis architecture as claimed in claim 1.

### Claim 15 (depends on 14)

The server as claimed in claim 14, comprising:
the plurality of PCIE modules, provided in the PCIE module installing area of the PCIE module layer;
fan modules, provided in a fan PCIE module installing area of the PCIE module layer;
a mainboard, provided in the mainboard installing area of the computing layer;
a power supply unit, provided in the power supply installing area of the computing layer;
the PCIE cable, an end of which is electrically connected to the plurality of PCIE modules, and another end of which passes through the plurality of first threading holes of the threading layer, then extends along an upper surface of the threading layer and passes through the plurality of second threading holes of the computing layer to be electrically connected to the mainboard or the power supply unit; and
a fan wiring, an end of which is electrically connected to the power supply unit, and the other end of which passes through the plurality of second threading holes of the computing layer and is electrically connected to the mainboard or the power supply unit.

### Claim 16 (depends on 14)

The server as claimed in claim 14, wherein the plurality of PCIE modules are aligned with each other in the PCIE module installing area; and the plurality of PCIE module comprise a graphic processing unit card, a field programmable gate array card, and an encryption card.

### Claim 17 (depends on 14)

The server as claimed in claim 14, wherein each of the plurality of PCIE modules comprises a fixed housing, and an end blocking plate and a card tail fixing support that are connected to two ends of the fixed housing; the end blocking plate is provided with a positioning pin and a handle, the positioning pin is in positioning snap-fit with a snap-fit port of the PCIE module installing area; the handle is rotatably provided on a top of the end blocking plate; a bottom of the card tail fixing support is provided with a knurled screw, and the knurled screw is in threaded connection with a threaded hole of the PCIE module installing area.

### Claim 18 (depends on 14)

The server as claimed in claim 14, wherein each of the plurality of PCIE modules comprises:
a riser card bracket, the riser card bracket being provided at a position of an outer side wall of each of the plurality of PCIE modules, two ends of the riser card bracket being respectively fixed to an end blocking plate and a card tail fixing support; when two PCIE modules are adjacently arranged, two riser card brackets are arranged up and down in a staggered manner;
a riser card, provided on the riser card bracket; and
a Mylar, provided on a side of the riser card away from the riser card bracket.

### Claim 19 (depends on 14)

The server as claimed in claim 14, wherein the riser card bracket is L-shaped; the riser card bracket comprises a fixing plate and a wire separation plate that are provided perpendicular to each other; the fixing plate is arranged parallel to an outer side wall of each of the plurality of PCIE modules; the wire separation plate is arranged perpendicular to the outer side wall of each of the plurality of PCIE modules; when two PCIE modules are arranged adjacent to each other, two wire separation plates are arranged parallel to each other vertically; and cables connected to the riser card are arranged on a side of two wire separation plates facing away from each other.

### Claim 20 (depends on 14)

The server as claimed in claim 14, wherein a fan module comprises a fan backplate and a fan unit; a power supply unit comprises a power supply board and a power supply unit; the PCIE cable is electrically connected to the power supply board; a fan wiring is electrically connected between a fan backplate and the mainboard, and/or a fan wiring is electrically connected between a fan backplate and a power supply board.