Heatsink techniques for optical and electrical modules

A printed circuit board assembly for use in a module configured for networking, computing, or storage, the printed circuit board assembly comprising:

• a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side;
• at least one component disposed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side;
• and
• a floating heatsink assembly mounted on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member, the floating heatsink assembly occupying only a limited vertical space on the secondary side.

A method of cooling at least one component disposed on a secondary side of a printed circuit board assembly in a hardware module for networking, computing, or storage, the method comprising:

• selecting the at least one component to be mounted on the secondary side of the printed circuit board assembly due to an increased complexity and component density preventing its placement on a primary side with greater vertical clearance;
• installing the at least one component on the secondary side;
• disposing a floating heatsink assembly on the secondary side to contact the at least one component;
• and
• biasing the floating heatsink assembly against the at least one component with at least one resilient member, wherein the resilient member and the floating heatsink assembly fit within a limited vertical space on the secondary side.