# US 2025/0167142 A1 · Pitch-reducing solder interconnect for rf transitions > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0167142 A1 - Document ID: US20250167142A1 - Status: Published application - Kind: A1 - Application number: 18/513,861 - Filed: 2023-11-20 - Published: 2025-05-22 - Earliest claimed: 2023-11-20 - Assignees: NXP USA, Inc. - Applicants: NXP USA, Inc. - Inventors: Michael B. Vincent; Nikita Mahjabeen - Web page: https://patentgrep.com/patent/US20250167142A1 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01P 5/028: {between strip lines} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/685: comprising multiple insulating layers - H10W 74/016: {using moulds} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H01P 5/107: Hollow-waveguide/strip-line transitions - H10W 44/216: {Waveguides, e.g. strip lines} - H10W 44/248: {for antennas} - H10W 72/07236: {Soldering or alloying} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 80/732: {having shape changed during the connecting} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) ## Abstract A radio frequency (RF) transition mechanism between an integrated circuit (IC) package and an interposer circuit board includes elongated structures to reduce a distance between conductors. Pairs of electrical interconnect pads on the IC package and/or pairs of electrical interconnect pads on the interposer circuit board are elongated on a common axis. The reduced distance between conductors reduces insertion loss at frequencies of interest. ## Claims ### Claim 1 A system comprising: an integrated circuit device having a first pair of electrical interconnect pads with solderable surfaces; and an interposer circuit board having a second pair of electrical interconnect pads with solderable surfaces, the second pair of electrical interconnect pads being configured to provide electrical coupling to the first pair of electrical interconnect pads through solder connections, and having a first pair of conductive paths spaced to create a radio frequency (RF) transmission line, wherein the first pair of conductive paths are electrically coupled to the second pair of electrical interconnect pads; wherein the first pair of electrical interconnect pads are noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the interposer circuit board. ### Claim 2 (depends on 1) The system of claim 1, wherein the first pair of electrical interconnect pads are elongated directly toward each other on the common axis. ### Claim 3 (depends on 1) The system of claim 1, wherein the first pair of electrical interconnect pads are elongated at an angle relative to the common axis, to provide a component of elongation on the common axis. ### Claim 4 (depends on 1) The system of claim 1, wherein the first pair of electrical interconnect pads are arranged according to a first pitch, the second pair of electrical interconnect pads are arranged according to a second pitch, and the first pitch and second pitch are equal. ### Claim 5 (depends on 1) The system of claim 1, wherein the first pair of electrical interconnect pads are arranged according to a first pitch, the second pair of electrical interconnect pads are arranged according to a second pitch, and the first pitch and second pitch are unequal. ### Claim 6 (depends on 1) The system of claim 1, wherein the integrated circuit device includes a bare integrated circuit die, and wherein the first pair of electrical interconnect pads are formed on the bare integrated circuit die. ### Claim 7 (depends on 1) The system of claim 1, wherein the integrated circuit device comprises: a bare integrated circuit die; a polymer layer formed on the bare integrated circuit die, wherein the polymer layer includes a plurality of conductive traces to redistribute electrical connections from the bare integrated circuit die; and a metallization layer formed on the polymer layer, wherein the metallization layer includes the first pair of electrical interconnect pads having solderable surfaces. ### Claim 8 (depends on 1) The system of claim 1, wherein the first pair of electrical interconnect pads are noncircular and elongated, and wherein the RF transition between the integrated circuit device and the interposer circuit board is formed between the first pair of electrical interconnect pads and the second pair of electrical interconnect pads. ### Claim 9 (depends on 1) The system of claim 1, wherein the interposer circuit board includes an RF launcher electrically coupled to the RF transmission line on the interposer circuit board. ### Claim 10 An interposer circuit board comprising: a first pair of conductive paths having a first spacing to create a radio frequency (RF) transmission line; and a first pair of electrical interconnect pads having solderable surfaces configured to be electrically coupled to an integrated circuit device using solder connections, wherein the first pair of electrical interconnect pads have a second spacing greater than the first spacing; wherein the first pair of electrical interconnect pads are electrically coupled to the RF transmission line, the first pair of electrical interconnect pads being noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the interposer circuit board. ### Claim 11 (depends on 10) The interposer circuit board of claim 10, further comprising a plurality of noncircular, elongated pairs of electrical interconnect pads, and wherein the first pair of electrical interconnect pads is one of the plurality of noncircular, elongated pairs of electrical interconnect pads. ### Claim 12 (depends on 10) The interposer circuit board of claim 10, further comprising an RF launcher electrically coupled to the RF transmission line. ### Claim 13 (depends on 10) The interposer circuit board of claim 10, further comprising a plurality of electrical interconnect pads arranged in a pattern corresponding to an arrangement of contacts of a ball grid array (BGA) package, wherein the plurality of electrical interconnect pads comprise the first pair of electrical interconnect pads. ### Claim 14 (depends on 10) The interposer circuit board of claim 10, wherein the first pair of electrical interconnect pads are elongated directly toward each other on the common axis. ### Claim 15 (depends on 10) The interposer circuit board of claim 10, wherein the first pair of electrical interconnect pads are elongated at an angle relative to the common axis, to provide a component of elongation on the common axis. ### Claim 16 An integrated circuit device comprising: a radio frequency (RF) circuit configured to produce RF energy; and a first pair of electrical interconnect pads with solderable surfaces configured to provide electrical coupling to a circuit board using solder connections; wherein the first pair of electrical interconnect pads are electrically coupled to the RF circuit to conduct the RF energy, the first pair of electrical interconnect pads being noncircular and elongated on a common axis and are configured, during a solder reflow process, to cause solder to flow in a direction of the common axis to form an RF transition between the integrated circuit device and the circuit board. ### Claim 17 (depends on 16) The integrated circuit device of claim 16, wherein the integrated circuit device includes a bare integrated circuit die, and wherein the first pair of electrical interconnect pads are formed on the bare integrated circuit die. ### Claim 18 (depends on 16) The integrated circuit device of claim 16, further comprising: a bare integrated circuit die that includes the RF circuit; a polymer layer formed on the bare integrated circuit die, wherein the polymer layer includes a plurality of conductive traces to redistribute electrical connections from the bare integrated circuit die; and a metallization layer formed on the polymer layer, wherein the metallization layer includes the first pair of electrical interconnect pads with solderable surfaces. ### Claim 19 (depends on 16) The integrated circuit device of claim 16, further comprising a plurality of noncircular, elongated pairs of electrical interconnect pads, and wherein the first pair of electrical interconnect pads is one of the plurality of noncircular, elongated pairs of electrical interconnect pads. ### Claim 20 (depends on 16) The integrated circuit device of claim 16, further comprising a plurality of electrical interconnect pads arranged in a pattern corresponding to an arrangement of contacts of a ball grid array (BGA) package, wherein the plurality of electrical interconnect pads comprise the first pair of electrical interconnect pads. ### Claim 21 A method comprising: fabricating an interposer circuit board having a first pair of conductive paths spaced to form a radio frequency (RF) transmission line, and having a first pair of electrical interconnect pads with solderable surfaces being noncircular and elongated on a common axis, wherein the first pair of electrical interconnect pads are electrically coupled to the RF transmission line; and electrically coupling an integrated circuit device to the interposer circuit board, wherein the electrically coupling comprises performing a solder reflow operation to allow solder to flow in a direction of the common axis of the first pair of electrical interconnect pads. ### Claim 22 (depends on 21) The method of claim 21, wherein the integrated circuit device includes a pair of circular electrical interconnect pads spaced to be electrically coupled to the first pair of electrical interconnect pads on the interposer circuit board. ### Claim 23 (depends on 21) The method of claim 21, wherein the integrated circuit device includes a pair of noncircular electrical interconnect pads spaced to be electrically coupled to the first pair of electrical interconnect pads on the interposer circuit board. ### Claim 24 (depends on 21) The method of claim 21, further comprising: molding over an integrated circuit die to produce a molded integrated circuit device, wherein the integrated circuit die includes an RF circuit configured to produce RF energy; forming a polymer layer on the molded integrated circuit device, wherein the polymer layer includes a second plurality of conductive paths to redistribute interconnects on the molded integrated circuit device to a ball grid array pattern having a pitch compatible with the interposer circuit board, wherein a second pair of the second plurality of conductive paths are electrically coupled to conduct the RF energy; and forming a metallization layer on the polymer layer to form the integrated circuit device, wherein the metallization layer includes a second pair of electrical interconnect pads electrically coupled to the second pair of the second plurality of conductive paths on the polymer layer to conduct the RF energy, wherein the second pair of electrical interconnect pads are spaced to be electrically coupled to the first pair of electrical interconnect pads on the interposer circuit board during the solder reflow operation to form an RF transition between the integrated circuit device and the interposer circuit board. ### Claim 25 (depends on 24) The method of claim 24, wherein the second pair of electrical interconnect pads on the integrated circuit device are circular. ### Claim 26 (depends on 24) The method of claim 24, wherein the second pair of electrical interconnect pads on the integrated circuit device are noncircular.