# US 2025/0164584 A1 · Sensor chip, magnetic sensor having the same, and magnetic sensor manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0164584 A1 - Document ID: US20250164584A1 - Status: Published application - Kind: A1 - Application number: 18/840,684 - Filed: 2022-02-25 - Published: 2025-05-22 - Earliest claimed: 2022-02-25 - Assignees: TDK Corporation - Applicants: TDK Corporation - Inventors: Ikuhito ONODERA; Osamu HARAKAWA - Web page: https://patentgrep.com/patent/US20250164584A1 ## CPC - G01R 33/093: {using multilayer structures, e.g. giant magnetoresistance sensors (thin magnetic films H01F10/00)} - G01R 33/0011: {comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor} - G01R 33/0017: {Means for compensating offset magnetic fields or the magnetic flux to be measured; Means for generating calibration magnetic fields} - G01R 33/0047: {Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders} - G01R 33/0052: {Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85)} - G01R 33/06: using galvano-magnetic devices - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 46/301: {for alignment} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract To accurately perform positioning of an external magnetic body with respect to a sensor chip. After mounting of a sensor chip on a substrate, an external magnetic body is mounted on the substrate so as to overlap a magnetic layer as viewed in the Y-direction perpendicular to an element formation surface. Further, the position of the external magnetic body in the X-direction is adjusted with reference to alignment marks which are provided so as to be visually confirmable from an upper surface side of the sensor chip. Thus, in a magnetic sensor assembly, a desired positional relation can be established between the sensor chip and the external magnetic body. ## Claims ### Claim 1 A sensor chip comprising: a chip main body having mounting surface and an upper surface positioned on an opposite sides to each other, and an element formation surface substantially perpendicular to the mounting surface and upper surface and including a lower area positioned close to the mounting surface side, an upper area positioned close to the upper surface side, and a center area positioned between the upper area and the lower area; first and second magnetic layers provided on the center area of the element formation surface and face each other through a magnetic gap; a magnetism detection element provided on the center area of the element formation surface and positioned on a magnetic path formed by the magnetic gap; an insulating layer provided on the element formation surface and covering the magnetism detection element and first and second magnetic layers; a terminal electrode provided at a part of a surface of the insulating layer that covers the lower area of the element formation surface and connected to the magnetism detection element; and a first alignment mark embedded in a part of the insulating layer that covers the upper area of the element formation surface and visually confirmable from the upper surface, wherein a position of the first alignment mark in an extending direction of an edge between the element formation surface and the upper surface overlaps the first magnetic layer. ### Claim 2 (depends on 1) The sensor chip as claimed in claim 1, further comprising a metal cover layer provided on the insulating layer so as to cover the first alignment mark. ### Claim 3 (depends on 2) The sensor chip as claimed in claim 2, wherein the metal cover layer is made of a same material as the terminal electrode. ### Claim 4 (depends on 1) The sensor chip as claimed in claim 1, further comprising a second alignment mark embedded in a part of the insulating layer that covers the upper area of the element formation surface and visually confirmable from the upper surface, wherein a position of the second alignment mark in the extending direction of the edge overlaps the second magnetic layer. ### Claim 5 (depends on 1) The sensor chip as claimed in claim 1, wherein the first alignment mark has one end and other end in the extending direction of the edge, wherein a position of the one end of the first alignment mark in the extending direction of the edge overlaps the first magnetic layer, and wherein a position of the other end of the first alignment mark in the extending direction of the edge overlaps the second magnetic layer. ### Claim 6 (depends on 1) A magnetic sensor comprising: a substrate; the sensor chip as claimed in claim 1 which is mounted on the substrate such that the mounting surface faces the substrate; and an external magnetic body mounted on the substrate so as to overlap the first magnetic layer as viewed in a direction perpendicular to the element formation surface, wherein an end face of the external magnetic body in the extending direction of the edge is substantially aligned with the first alignment mark. ### Claim 7 (depends on 1) A method of manufacturing a magnetic sensor, the method comprising: a first step of mounting the sensor chip as claimed in claim 1 on a substrate such that the mounting surface faces the substrate; and a second step of mounting an external magnetic body on the substrate so as to overlap the first magnetic layer as viewed in a direction perpendicular to the element formation surface, wherein the second step includes adjusting a position of the external magnetic body in the extending direction of the edge with reference to the first alignment mark.