# US 2025/0164530 A1 · Current sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0164530 A1 - Document ID: US20250164530A1 - Status: Published application - Kind: A1 - Application number: 18/953,081 - Filed: 2024-11-20 - Published: 2025-05-22 - Earliest claimed: 2023-11-21 - Assignees: Asahi Kasei Microdevices Corporation - Applicants: Asahi Kasei Microdevices Corporation - Inventors: Masaki TSUJIMOTO - Web page: https://patentgrep.com/patent/US20250164530A1 ## CPC - G01R 15/202: {using Hall-effect devices (Hall elements in arrangements for measuring electrical power G01R21/08)} - G01R 15/205: {using magneto-resistance devices, e.g. field plates} - G01R 15/207: {Constructional details independent of the type of device used} - G01R 19/0092: {Measuring current only} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A current sensor includes a first lead frame having a first terminal portion and a conductive portion coupled to the first terminal portion, wherein a measurement current measured by the at least one magnetoelectric conversion element flows through the first terminal portion and the conductive portion; and a signal processing IC that processes a signal output from the at least one magnetoelectric conversion element, arranged on a second surface side opposing a first surface of the conductive portion, having a circuit surface with the at least one magnetoelectric conversion element arranged thereon. The conductive portion has a first corner between a first end surface opposing a side coupled to the first terminal portion and a second surface facing the signal processing IC, and a second corner between the first end surface and a first surface opposing the second surface facing the signal processing IC. ## Claims ### Claim 1 A current sensor, comprising: at least one magnetoelectric conversion element; a first lead frame having a first terminal portion and a conductive portion coupled to the first terminal portion, wherein a measurement current measured by the at least one magnetoelectric conversion element flows through the first terminal portion and the conductive portion; a signal processing IC that processes a signal output from the at least one magnetoelectric conversion element, arranged on a second surface side opposing a first surface of the conductive portion, having a circuit surface facing the second surface, with the at least one magnetoelectric conversion element arranged thereon; and a sealing portion that seals the at least one magnetoelectric conversion element, the conductive portion and the signal processing IC, wherein the conductive portion has a first corner between a first end surface opposing a side coupled to the first terminal portion and a second surface facing the signal processing IC, and a second corner between the first end surface and a first surface opposing the second surface facing the signal processing IC; and wherein an outer surface area of the first corner is greater than an outer surface area of the second corner. ### Claim 2 (depends on 1) The current sensor according to claim 1, wherein the first corner is a chamfered surface. ### Claim 3 (depends on 1) The current sensor according to claim 1, wherein either one of a width in a direction along the second surface of the conductive portion when the first corner is projected in a direction along the first end surface or a width in a direction along the first end surface when the first corner is projected in a direction along the second surface of the conductive portion is greater than 15 μm and shorter than a thickness of the conductive portion. ### Claim 4 (depends on 1) The current sensor according to claim 1, wherein a width in a direction along the second surface of the conductive portion when the first corner is projected in a direction along the first end surface is longer than a width in a direction along the first end surface when the first corner is projected in a direction along the second surface of the conductive portion. ### Claim 5 (depends on 1) The current sensor according to claim 1, wherein: the conductive portion has: a first portion coupled to the first terminal portion; and a second portion arranged facing the circuit surface of the signal processing IC, being shifted with respect to the first portion and coupled to the first portion in a direction away from the circuit surface of the signal processing IC in a thickness direction; the second portion has a third corner between a second end surface on a side coupled to the first portion and a first surface opposing a second surface facing the circuit surface of the signal processing IC; and an outer surface area of the third corner is greater than an outer surface area of a fourth corner between the second end surface of the second portion and a first surface of the first portion, which is on a side identical to the first surface of the second portion. ### Claim 6 (depends on 5) The current sensor according to claim 5, wherein the third corner is a chamfered surface. ### Claim 7 (depends on 5) The current sensor according to claim 5, wherein either one of a width in a direction along a first surface opposing the second surface of the conductive portion when the third corner is projected in a direction along the second end surface or a width in a direction along the second end surface when the third corner is projected in a direction along the first surface of the conductive portion is greater than 15 μm and shorter than a thickness of the conductive portion. ### Claim 8 (depends on 5) The current sensor according to claim 5, wherein a shift amount of the second portion with respect to the first portion is 0.6 times or less of a thickness of the conductive portion. ### Claim 9 (depends on 5) The current sensor according to claim 5, wherein the second end surface of the second portion has a sheared surface. ### Claim 10 (depends on 5) The current sensor according to claim 5, further comprising a second lead frame, electrically insulated from the first lead frame, arranged to face the first terminal portion with the signal processing IC sandwiched therebetween in a planar view, having a second terminal portion electrically coupled to the signal processing IC and a support portion that supports, on a first surface, a surface opposing the circuit surface on a side of the conductive portion of the signal processing IC, wherein the first portion has a fifth corner between a third end surface on a side coupled to the second portion and a second surface on a side identical to the second surface of the second portion; and wherein an outer surface area of the fifth corner is greater than an outer surface area of a sixth corner between the third end surface of the first portion and the second surface of the second portion. ### Claim 11 (depends on 10) The current sensor according to claim 10, wherein the fifth corner is a chamfered surface. ### Claim 12 (depends on 10) The current sensor according to claim 10, wherein either one of a width in a direction along the second surface of the first portion when the fifth corner is projected in a direction along the third end surface or a width in a direction along the third end surface when the fifth corner is projected in a direction along the second surface of the first portion is greater than 15 μm and is shorter than a thickness of the conductive portion. ### Claim 13 (depends on 10) The current sensor according to claim 10, wherein: the support portion has a seventh corner between the first surface that supports the signal processing IC and a fourth end surface on a side of the first terminal portion, and an eighth corner between a second surface opposing the first surface that supports the signal processing IC and the fourth end surface; and an outer surface area of the seventh corner is greater than an outer surface area of the eighth corner. ### Claim 14 (depends on 3) The current sensor according to claim 3, wherein the sealing portion is composed of mold resin, and the mold resin contains filler with a diameter of 20 um or greater, and a filler filling ratio is 60% or greater. ### Claim 15 (depends on 1) The current sensor according to claim 1, wherein the at least one magnetoelectric conversion element protrudes from the circuit surface up to a position overlapping the conductive portion as viewed from a direction intersecting a thickness direction of the at least one magnetoelectric conversion element. ### Claim 16 (depends on 1) The current sensor according to claim 1, wherein: the conductive portion has at least one slit portion; and the at least one magnetoelectric conversion element is at least partially enclosed by the conductive portion by being respectively arranged inside the at least one slit portion in a planar view. ### Claim 17 (depends on 16) The current sensor according to claim 16, wherein the at least one magnetoelectric conversion element is respectively fixed on the circuit surface by die bonding inside the at least one slit portion, and is electrically coupled to the signal processing IC by wire bonding in a planar view. ### Claim 18 (depends on 17) The current sensor according to claim 17, wherein a magnetosensitive surface of the at least one magnetoelectric conversion element is arranged in a position overlapping a side surface with the at least one slit of the conductive portion provided thereon as viewed from a direction intersecting a thickness direction of the at least one magnetoelectric conversion element. ### Claim 19 A current sensor, comprising: at least one magnetoelectric conversion element; a first lead frame having a first terminal portion and a conductive portion coupled to the first terminal portion, wherein a measurement current measured by the at least one magnetoelectric conversion element flows through the first terminal portion and the conductive portion; a signal processing IC that processes a signal output from the at least one magnetoelectric conversion element, arranged on a second surface side opposing a first surface of the conductive portion, having a circuit surface facing the second surface, with the at least one magnetoelectric conversion element arranged thereon; and a sealing portion that seals the at least one magnetoelectric conversion element, the conductive portion and the signal processing IC, wherein the conductive portion has: a first portion coupled to the first terminal portion; and a second portion arranged facing the circuit surface of the signal processing IC, being shifted with respect to the first portion and coupled to the first portion in a direction away from the circuit surface of the signal processing IC in a thickness direction; wherein the second portion has a third corner between a second end surface on a side coupled to the first portion and a first surface opposing a second surface facing the circuit surface of the signal processing IC; and an outer surface area of the third corner is greater than an outer surface area of a fourth corner between the second end surface of the second portion and a first surface of the first portion, which is on a side identical to the first surface of the second portion. ### Claim 20 A current sensor, comprising: at least one magnetoelectric conversion element; a first lead frame having a first terminal portion and a conductive portion coupled to the first terminal portion, wherein a measurement current measured by the at least one magnetoelectric conversion element flows through the first terminal portion and the conductive portion; a signal processing IC that processes a signal output from the at least one magnetoelectric conversion element, having a circuit surface with the at least one magnetoelectric conversion element arranged thereon; a second lead frame, electrically insulated from the first lead frame, arranged to face the first terminal portion with the signal processing IC sandwiched therebetween in a planar view, having a second terminal portion electrically coupled to the signal processing IC and a support portion that supports the signal processing IC on a first surface; and a sealing portion that seals the at least one magnetoelectric conversion element, the conductive portion, the signal processing IC and the support portion, wherein the conductive portion includes a first sheared surface that is a step or an end surface with a sheared surface, on a side closer to the first terminal portion than the signal processing IC in a planar view and facing toward a side of the second terminal portion, with an outer surface area of a fifth corner closer to a second surface opposing the first surface of the support portion being greater than an outer surface area of a sixth corner further from the second surface at a corner of the first sheared surface.