Diphenyl(meth)acrylamide-containing thermosetting resin composition and cured product therefrom

A thermosetting resin composition comprising:

• (A) at least one compound of formula (I):
• (wherein
• X1 and X2 each independently represent a C1-C20 alkyl group, a C1-C20 alkoxy group, a C3-C6 cyclic alkyl group, a C3-C6 cyclic alkoxy group, a benzyl group, or an α,α-dimethylbenzyl group,
• n1 and n2 each independently represent 0 or 1,
• Z1 and Z2 each independently represent a single bond or a C1-C3 alkylene group,
• X3 and X4 each independently represent an organic group or a halogeno group,
• m1 and m2 each independently represent any integer from 0 to 4, and
• Y represents a polymerizable functional group), and
• (B) at least one of the following (B-1) to (B-5):
• (B-1) a maleimide compound having one or more maleimide groups;
• (B-2) a polyphenylene ether compound;
• (B-3) polybutadiene having a molar ratio of 1,2-bond structure to 1,4-bond structure of 80:20 to 100:0;
• (B-4) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of 1,2-bond structure to 1,4-bond structure in the butadiene block of 80:20 to 100:0;
• and
• (B-5) a polymer having a repeat unit of formula (III) in the molecule:
• (wherein Z3 represents a C6-C12 arylene group, R2 to R4 each independently represent a hydrogen atom or a C1-C6 alkyl group, and R5 to R7 each independently represent a hydrogen atom or a C1-C6 alkyl group).