# US 2025/0160031 A1 · Electronic device package and fabricating method thereof

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- Number: US 2025/0160031 A1
- Document ID: US20250160031A1
- Status: Published application
- Kind: A1
- Application number: 19/025,710
- Filed: 2025-01-16
- Published: 2025-05-15
- Earliest claimed: 2012-11-20
- Assignees: Amkor Technology Singapore Holding Pte. Ltd.
- Applicants: Amkor Technology Singapore Holding Pte. Ltd.
- Inventors: Jin Young Kim; No Sun Park; Yoon Joo Kim; Seung Jae Lee; Se Woong Cha; Sung Kyu Kim; Ju Hoon Yoon
- Web page: https://patentgrep.com/patent/US20250160031A1

## CPC

- H10F 39/811: {Interconnections}
- H10F 39/198: {Contact-type image sensors [CIS]}
- H10F 39/804: {Containers or encapsulations}
- H10W 20/427: {Power or ground buses}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/635: {Through-vias}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- G06V 40/12: Fingerprints or palmprints
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/6528: {of the portions that connect to chips, wafers or package parts}
- H10W 72/9413: {on encapsulations}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING

## Abstract

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

## Claims

### Claim at position 1

1-20. (canceled)

### Claim 21

An electronic device comprising:
a signal distribution structure comprising a conductor and a dielectric material, the conductor having a first side oriented in a first direction and a second side oriented in a second direction opposite the first direction, the dielectric material covering the second side of the conductor, the dielectric material forming a first exterior side of the electronic device facing the second direction;
a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad facing the first direction;
an encapsulant that laterally covers the lateral die sides, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
an interconnect structure passing through the encapsulant, wherein the interconnect structure is electrically coupled to the bond pad and the conductor;
a protection structure over the first die side and spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device facing the first direction, opposite the first exterior side, with no conductive material exposed at the second exterior side; and
an insulating material between the protection structure and the first die side.

### Claim 22 (depends on 21)

The electronic device of claim 21, comprising an external interconnect coupled to the conductor, wherein the external interconnect extends beyond the first exterior side formed by the dielectric material.

### Claim 23 (depends on 22)

The electronic device of claim 22, wherein the external interconnect comprises a solder ball.

### Claim 24 (depends on 22)

The electronic device of claim 22, wherein the external interconnect comprises a land.

### Claim 25 (depends on 21)

The electronic device of claim 21, wherein the second encapsulant side is coplanar with the second die side.

### Claim 26 (depends on 21)

The electronic device of claim 21, wherein the protection structure extends laterally to cover an entirety of the sensor.

### Claim 27 (depends on 21)

The electronic device of claim 21, wherein the insulating material contacts the first die side and an interior side of the protection structure facing the second direction, opposite the second exterior side.

### Claim 28 (depends on 21)

The electronic device of claim 21, wherein the lateral encapsulant side and a lateral side of the signal distribution structure are coplanar.

### Claim 29 (depends on 21)

The electronic device of claim 21, wherein the insulating material contacts at least a portion of the first die side and at least a portion of the encapsulant.

### Claim 30 (depends on 21)

The electronic device of claim 21, wherein:
the encapsulant comprises molding compound, and
the encapsulant contacts at least the lateral die sides, the protection structure, and an interior side of the signal distribution structure facing the first direction, opposite the first exterior side.

### Claim 31

An electronic device comprising:
a signal distribution structure comprising a conductor and a dielectric material laterally surrounding the conductor, the signal distribution structure having a first side forming a first exterior side of the electronic device and a second side opposite the first side;
a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad;
an interconnect structure electrically coupling the bond pad and the conductor;
an encapsulant that laterally covers the lateral die sides and the interconnect structure, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side; and
a protection structure over the first die side, the protection structure spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device, opposite the first exterior side, with no conductive material exposed at the second exterior side.

### Claim 32 (depends on 31)

The electronic device of claim 31, comprising an external interconnect coupled to the conductor, wherein the external interconnect extends beyond the first exterior side formed by the first side of the signal distribution structure.

### Claim 33 (depends on 31)

The electronic device of claim 31, wherein the protection structure extends laterally to cover an entirety of the sensor.

### Claim 34 (depends on 31)

The electronic device of claim 31, wherein the lateral encapsulant side and a lateral side of the signal distribution structure are coplanar.

### Claim 35 (depends on 31)

The electronic device of claim 31, wherein:
the encapsulant comprises molding compound, and
the encapsulant contacts at least the lateral die sides, the protection structure, and second side of the signal distribution structure, opposite the first exterior side.

### Claim 36

A method of manufacturing an electronic device, the method comprising:
providing a signal distribution structure comprising a conductor and a dielectric material, the conductor having a first side oriented in a first direction and a second side oriented in a second direction opposite the first direction, the dielectric material covering the second side of the conductor, the dielectric material forming a first exterior side of the electronic device facing the second direction;
providing a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad facing the first direction;
electrically coupling the bond pad and the conductor with an interconnect structure;
providing an encapsulant that laterally covers the lateral die sides and the interconnect structure, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
providing an insulating material over the first die side; and
providing a protection structure over the insulating material and the first die side, the protection structure spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device facing the first direction, opposite the first exterior side, with no conductive material exposed at the second exterior side.

### Claim 37 (depends on 36)

The method of claim 36, comprising providing an external interconnect coupled to the conductor, wherein the external interconnect extends beyond the first exterior side formed by the dielectric material.

### Claim 38 (depends on 36)

The method of claim 36, wherein the protection structure extends laterally to cover an entirety of the sensor.

### Claim 39 (depends on 36)

The method of claim 36, wherein the lateral encapsulant side and a lateral side of the signal distribution structure are coplanar.

### Claim 40 (depends on 36)

The method of claim 36, wherein:
the encapsulant comprises molding compound, and
the encapsulant contacts at least the lateral die sides, the protection structure, and an interior side of the signal distribution structure facing the first direction, opposite the first exterior side.