# US 2025/0159810 A1 · Printed circuit board assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0159810 A1 - Document ID: US20250159810A1 - Status: Published application - Kind: A1 - Application number: 18/942,720 - Filed: 2024-11-10 - Published: 2025-05-15 - Earliest claimed: 2023-11-10 - Applicants: Rolls-Royce Deutschland Ltd & Co KG - Inventors: Uwe WALTRICH; Dipenkumar PATEL; Gergely László HEGEDÜS-FUCHS - Web page: https://patentgrep.com/patent/US20250159810A1 ## CPC - H05K 1/181: associated with surface mounted components - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 3/0008: {for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015)} - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 7/2049: {Pressing means used to urge contact, e.g. springs} - H10W 40/611: {Bolts or screws} - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H05K 2201/10409: Screws - H05K 2201/10522: Adjacent components - H05K 2201/2009: Reinforced areas, e.g. for a specific part of a flexible printed circuit - H05K 2201/2072: Anchoring, i.e. one structure gripping into another - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, an electrical module having an upper side and a lower side, and a holding down construction. The upper side of the electrical module is arranged on the lower side of the printed circuit board. The holding down construction includes screwing posts that are configured to be screwed against the printed circuit board. The holding down construction is arranged on the upper side of the printed circuit board and includes contact structures that are at a distance from the screwing posts and configured to rest or press on the printed circuit board at specific contact points only. The printed circuit board includes dedicated support points that correspond to the specific contact points of the holding down construction and are contacted by the specific contact points. The dedicated support points are mechanically reinforced. ## Claims ### Claim 1 A printed circuit board assembly comprising: a printed circuit board having an upper side and a lower side; at least one electrical module having an upper side and a lower side, the upper side of an electrical module of the at least one electrical module being arranged on the lower side of the printed circuit board; and a holding down construction for the printed circuit board, the holding down construction comprising screwing posts that are configured to be screwed against the printed circuit board, wherein the holding down construction is arranged on the upper side of the printed circuit board and comprises contact structures that are at a distance from the screwing posts and configured to rest or press on the printed circuit board at specific contact points only, wherein the printed circuit board comprises dedicated support points that correspond to the specific contact points of the holding down construction and are contacted by the specific contact points, and wherein the dedicated support points are mechanically reinforced. ### Claim 2 (depends on 1) The printed circuit board assembly of claim 1, wherein the contact structures that are configured to rest or press on the printed circuit board are formed as pushing pins configured to punctually assert a pressure against the printed circuit board, and wherein the specific contact points are formed by face sides of the pushing pins that rest against the dedicated support points of the printed circuit board. ### Claim 3 (depends on 1) The printed circuit board assembly of claim 1, wherein the pushing pins are arranged on ribs formed by the holding down construction. ### Claim 4 (depends on 1) The printed circuit board assembly of claim 1, wherein the dedicated support points are mechanically reinforced by at least one metal layer. ### Claim 5 (depends on 4) The printed circuit board assembly of claim 4, wherein the dedicated support points are mechanically reinforced by a layer structure, layers of the layer structure being metal layers, and wherein the metal layers are not current-carrying layers. ### Claim 6 (depends on 5) The printed circuit board assembly of claim 5, wherein the mechanically reinforcing layer structure comprises at least two upper metal layers connected by vias. ### Claim 7 (depends on 1) The printed circuit board assembly of claim 1, wherein the at least one electrical module comprises a plurality of electrical modules, wherein the plurality of electrical modules are arranged on the lower side of the circuit board in parallel rows, wherein at least two of the parallel rows form assemblies, each of the assemblies including four electrical modules of the plurality of electrical modules arranged in a rectangular pattern, and wherein each of the assemblies of four electrical modules is associated with one dedicated support point on the upper side of the printed circuit board. ### Claim 8 (depends on 7) The printed circuit board assembly of claim 7, wherein the dedicated support points on the upper side of the printed circuit board are positioned such that each of the respective opposite points on the lower side of the printed circuit board lies centrally between the four electrical modules of an assembly of the assemblies. ### Claim 9 (depends on 1) The printed circuit board assembly of claim 1, wherein the holding down construction is configured to rest against the upper side of the printed circuit board without providing a pressure on the printed circuit board when the printed circuit board is not bent towards the holding down construction. ### Claim 10 (depends on 2) The printed circuit board assembly of claim 2, wherein the holding down construction is configured to press on the printed circuit board under provision of a preload, the preload providing a force acting on the printed circuit board even when the printed circuit board is not bent towards the holding down construction. ### Claim 11 (depends on 10) The printed circuit board assembly of claim 10, wherein the pushing pins have a length such that the pushing pins press on the upper side of the printed circuit board even when the upper side is not bent. ### Claim 12 (depends on 1) The printed circuit board assembly of claim 1, further comprising: a heat sink having an upper side; a gap between the upper side of the heat sink and the lower side of the electrical module; and a heat-conducting material, wherein the heat-conducting material is arranged in the gap, and wherein the lower side of the at least one electrical module is thermally coupled to the heat sink through the heat-conducting material. ### Claim 13 (depends on 12) The printed circuit board assembly of claim 12, further comprising: a positioning system configured to position the holding down construction with respect to the printed circuit board, wherein the positioning system comprises pre-assembly features in the printed circuit board and in the holding down construction. ### Claim 14 (depends on 13) The printed circuit board assembly of claim 13, wherein the positioning system comprises two positioning pins that are arranged in the heat sink, and printed circuit board positioning holes in the printed circuit board and holding down construction positioning holes in the holding down construction, wherein the positioning pins extend from the heat sink through the printed circuit board positioning holes and the holding down construction positioning holes. ### Claim 15 (depends on 14) The printed circuit board assembly of claim 14, wherein one printed circuit board positioning hole of the printed circuit board positioning holes and one holding down construction positioning hole of the holding down construction positioning holes configured to pass one of the two positioning pins through are circular holes, and wherein the other circuit board positioning hole of the printed circuit board positioning holes and the other holding down construction positioning hole of the holding down construction positioning holes configured to pass the other of the two positioning pins through are oblong holes.