Back to results
US 2025/0159804 A1Published application
Printed circuit board having optional circuit unit
AssigneeSamsung Electronics Co., Ltd.
InventorKihun OH
Life of this patent
Estimating the term…
Abstract
The disclosure relates generally to a printed circuit board having a structure in which two circuit portions are provided on a printed circuit board and a signal line may be selectively connected to one of the two circuit portions. In other words, the disclosure relates to a printed circuit board having selectable optional circuit portions.
Claims15
A printed circuit board comprising:
- an insulating layer;
- a first circuit portion and a second circuit portion provided on an upper surface of the insulating layer;
- a first via and a second via provided between the first circuit portion and the second circuit portion, and penetrating the insulating layer;
- a first signal pad provided between the first circuit portion and the second circuit portion on the upper surface of the insulating layer and configured to be connected to an upper end of the first via, and having only one pad connection portion;
- a second signal pad provided adjacent to the first signal pad between the first circuit portion and the second circuit portion on the upper surface of the insulating layer and configured to be connected to an upper end of the second via, and having only one pad connection portion;
- a first signal line connected to the first circuit portion on the upper surface of the insulating layer and including a first pad provided adjacent to the first signal pad;
- a second signal line connected to the first circuit portion in parallel with the first signal line on the upper surface of the insulating layer and including a second pad provided adjacent to the second signal pad;
- a third signal line connected to the second circuit portion on the upper surface of the insulating layer and including a third pad provided adjacent to the first signal pad;
- a fourth signal line connected to the second circuit portion in parallel with the third signal line on the upper surface of the insulating layer and including a fourth pad provided adjacent to the second signal pad;
- a first connecting element comprising a conductive material configured to connect the pad connection portion of the first signal pad to one of the first pad and the third pad;
- and
- a second connecting element comprising a conductive material configured to connect the pad connection portion of the second signal pad to one of the second pad and the fourth pad.
9 more elements
Dependencies are inferred from the claim text.