# US 2025/0159797 A1 · Membrane circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0159797 A1 - Document ID: US20250159797A1 - Status: Published application - Kind: A1 - Application number: 18/582,991 - Filed: 2024-02-21 - Published: 2025-05-15 - Earliest claimed: 2023-11-09 - Assignees: Chicony Electronics Co., Ltd. - Applicants: Chicony Electronics Co., Ltd. - Inventors: CHIH-HUNG LIN; CHIH-YI LU - Web page: https://patentgrep.com/patent/US20250159797A1 ## CPC - H05K 1/0298: {Multilayer circuits} - H05K 3/4617: {characterized by laminating only or mainly similar single-sided circuit boards} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A membrane circuit board includes a first substrate, a second substrate, a space layer and a conductive adhesive. The first substrate includes a plurality of first butting circuits and at least one first transmission circuit. The first transmission circuit is connected to one of the first butting circuits. The second substrate includes a plurality of second butting circuits, each corresponding to one of the first butting circuits. The space layer is disposed between the first substrate and the second substrate. The space layer includes a butting opening and at least one first stress weakening portion. One end of the first stress weakening portion is connected to the butting opening, and the first stress weakening portion corresponds to the first transmission circuit. The conductive adhesive is disposed within the butting opening and is in contact with both the first butting circuits and the second butting circuits. ## Claims ### Claim 1 A membrane circuit board, comprising: a first substrate comprising a plurality of first butting circuits and at least one first transmission circuit, the first transmission circuit being connected to one of the first butting circuits; a second substrate comprising a plurality of second butting circuits, each corresponding to one of the first butting circuits; a space layer disposed between the first substrate and the second substrate, the space layer comprising a butting opening and at least one first stress weakening portion, one end of the first stress weakening portion being connected to the butting opening, and the first stress weakening portion corresponding to the first transmission circuit; and a conductive adhesive disposed within the butting opening, contacting both the first butting circuit and the second butting circuit. ### Claim 2 (depends on 1) The membrane circuit board according to claim 1, further comprising: a compression reference region distributed within the butting opening, wherein the area of the compression reference region is greater than the area of one surface of the conductive adhesive. ### Claim 3 (depends on 2) The membrane circuit board according to claim 2, wherein one end of the compression reference region is projected to a bottom surface of the first transmission circuit as a first projection point, a bottom inner wall of the first stress weakening portion is projected to a top surface of the first transmission circuit as a second projection point, and the slope of the line connecting the first projection point and the second projection point is less than or equal to 0.0245. ### Claim 4 (depends on 2) The membrane circuit board according to claim 2, wherein the distance from one end of the compression reference region towards the first stress weakening portion to a bottom inner wall of the first stress weakening portion is greater than or equal to 1.25 mm. ### Claim 5 (depends on 1) The membrane circuit board according to claim 1, wherein the first stress weakening portion is an opening extending outward from one end of the butting opening. ### Claim 6 (depends on 1) The membrane circuit board according to claim 1, wherein the first stress weakening portion accommodates a portion of the conductive adhesive that is compressed. ### Claim 7 (depends on 1) The membrane circuit board according to claim 1, wherein the first substrate comprises a plurality of the first transmission circuits, the space layer comprises a plurality of the first stress weakening portions, and each of the first stress weakening portions corresponds to one of the first transmission circuits. ### Claim 8 (depends on 1) The membrane circuit board according to claim 1, wherein the first substrate comprises a plurality of the first transmission circuits, and the first stress weakening portion corresponds to the plurality of first transmission circuits. ### Claim 9 (depends on 1) The membrane circuit board according to claim 1, wherein the first substrate further comprises at least one second stress weakening portion, which is close to one end opposite to the first transmission circuit of the first butting circuits. ### Claim 10 (depends on 9) The membrane circuit board according to claim 9, wherein the second stress weakening portion is an opening structure, creating a free end structure at one end adjacent to the first butting circuits and the second stress weakening portion. ### Claim 11 (depends on 1) The membrane circuit board according to claim 1, wherein the second substrate further comprises at least one third stress weakening portion, adjacent to one end of the second butting circuit and corresponding to a portion of the first transmission circuit.