# US 2025/0157792 A1 · Symmetrical Process Reactor

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- Number: US 2025/0157792 A1
- Document ID: US20250157792A1
- Status: Published application
- Kind: A1
- Application number: 18/835,867
- Filed: 2023-01-27
- Published: 2025-05-15
- Earliest claimed: 2022-02-07
- Inventors: Stephan Wege
- Web page: https://patentgrep.com/patent/US20250157792A1

## CPC

- H01J 37/3244: {Gas supply means}
- H01J 37/32458: {Vessel}
- H01J 37/32715: {Workpiece holder}
- H01J 37/32743: {for introducing the material into processing chamber}
- H01J 2237/334: Etching
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

A process reactor (10) for plasma etching with atomic precision (ALE) of a substrate (12) to be processed and/or for plasma assisted deposition of atomic layers on the substrate (12) includes a reaction chamber (16) in which a table (18) and/or a holder for the substrate (12) is provided. By means of a gas supply (31), the substrate (12) is uniformly covered with gas in the reaction chamber (12). A pump (60) is used to evacuate the reaction chamber (16). A plasma generator (46) for generating a plasma (10) in the reaction chamber (16) are also provided.

## Claims

### Claim at position 1

-11. (canceled)

### Claim 12

A process reactor (10) for plasma etching with atomic precision of a substrate (12) to be processed and/or for plasma assisted deposition of atomic layers on the substrate (12), comprising:
a reaction chamber (16);
a table (18) and/or a holder for the substrate (12) in the reaction chamber (16);
a gas supply (31) which uniformly covers the substrate (12) with gas in the reaction chamber (12);
a pump (60) for evacuating the reaction chamber (16); and
a plasma generator (46) for generating a plasma in the reaction chamber (16),
wherein the reaction chamber (16) is rotationally symmetrical, with the pump (60) being centrally symmetrically arranged below the table (18) and/or the holder in the reaction chamber (16).

### Claim 13 (depends on 12)

The process reactor (10) according to claim 12,
wherein at least one tubular profile body (20) is provided for positioning the table (18) and/or the holder in the reaction chamber (16) above the pump (60).

### Claim 14 (depends on 13)

The process reactor (10) according to claim 13,
wherein at least one supply line (21) is guided from outside the reaction chamber (16) through the tubular profile body (20) to the table (18) and/or to the holder.

### Claim 15 (depends on 14)

The process reactor (10) according to claim 14,
wherein a through passage (27) for the supply line (21) is provided in a connection region of the tubular profile body (20) to the table (18) and/or the holder.

### Claim 16 (depends on 12)

The process reactor (10) according to claim 12,
wherein at least six tubular profile bodies (20) are arranged radially symmetrically for positioning the table (18) and/or the holder in the reaction chamber (16).

### Claim 17 (depends on 12)

The process reactor (10) according to claim 12,
wherein the table (18) and/or the holder in the reaction chamber (16) is height-adjustable.

### Claim 18 (depends on 12)

The process reactor (10) according to claim 12,
wherein the substrate (12) to be processed is arranged centrally in the rotationally symmetrical reaction chamber (16).

### Claim 19 (depends on 12)

The process reactor (10) according to claim 12
wherein the gas supply (31) comprises a gas injector (32) which includes a pipe ring (34) with radially symmetrical nozzles (36) pointing towards a central axis (38), in which the substrate (12) to be processed is arranged centrally.

### Claim 20 (depends on 19)

The process reactor (10) according to claim 19,
wherein the pipe ring (34) has at least one bypass (40) for uniform supply of the nozzles (36).

### Claim 21 (depends on 12)

The process reactor (10) according to claim 12,
wherein a back pressure generator (48) is provided.

### Claim 22 (depends on 12)

The process reactor (10) according to claim 12,
wherein a vacuum lock (29) is provided for introducing the substrate (12).