# US 2025/0157722 A1 · Processing method of surface-mounted transformer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0157722 A1 - Document ID: US20250157722A1 - Status: Published application - Kind: A1 - Application number: 19/021,078 - Filed: 2025-01-14 - Published: 2025-05-15 - Earliest claimed: 2020-11-30 - Assignees: Shenzhen Sunlord Electronics Co., Ltd. - Applicants: Shenzhen Sunlord Electronics Co., Ltd. - Inventors: Hui LIN; Wei Xie - Web page: https://patentgrep.com/patent/US20250157722A1 ## CPC - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01F 27/292: {Surface mounted devices} - H01F 1/344: {Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4} - H01F 1/37: in a bonding agent - H01F 27/022: {Encapsulation} - H01F 27/255: made from particles (H01F27/26 takes precedence) - H01F 27/2823: {Wires (H01F27/2866 takes precedence)} - H01F 27/2828: {Construction of conductive connections, of leads} - H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support} - H01F 41/0246: {Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36)} - H01F 41/04: for manufacturing coils {(coils for transformer or inductances H01F27/28)} - H01F 41/10: Connecting leads to windings (making electric connections in general H01R43/00) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A processing method of a surface-mounted transformer, comprising the following steps: hanging lead starting ends on electrodes and conducting welding and fixation by hot pressing; winding, wherein a coil is wound on a middle pillar of an I-shaped magnetic core; hanging lead finishing ends on the electrodes and conducting welding and fixation by hot pressing to obtain a winding product; leading out leading-out ends of the coil in a right-angle manner relative to connecting lines of the electrodes on a same side and conducting welding and fixation by hot pressing; molding pressing and solidifying forming, wherein a magnetic molding material is injected into a mold cavity in which the winding product is stored for mold pressing, solidifying forming is carried out and finally, an adhesive layer coating structure is formed around the winding product; finally, demolding. The product is high in reliability and can support a PSIP plastic package environment. ## Claims ### Claim 1 A processing method of a surface-mounted transformer, comprising the following steps: hanging lead starting ends on electrodes and conducting welding and fixation by hot pressing; winding, wherein a coil is wound on a middle pillar of an I-shaped magnetic core; hanging lead finishing ends on the electrodes and conducting welding and fixation by hot pressing to obtain a winding product; leading out leading-out ends of the coil in a right-angle manner relative to connecting lines of the electrodes on a same side and conducting welding and fixation by hot pressing; molding pressing and solidifying forming, wherein a magnetic molding material is injected into a mold cavity in which the winding product is stored for mold pressing, solidifying forming is carried out and finally, an adhesive layer coating structure is formed around the winding product; finally, demolding. ### Claim 2 (depends on 1) The processing method of the surface-mounted transformer according to claim 1, further comprising: pasting a layer of high-temperature-resistant adhesive paper on a bottom surface of a mold Carrier plate before the step of molding pressing and solidifying forming, and then putting the winding product in a cavity of the Carrier plate; making the electrodes of the winding product in contact with the high-temperature-resistant adhesive paper, and then installing the Carrier plate on a mold; putting a material cake made of the magnetic molding material into a feeding room and then conducting die assembly and compression molding forming; a process of the compression molding forming comprises: making the material cake made of the magnetic molding material form a viscous state at a set temperature at first and then flow at a set filling pressure till the cavity of the Carrier plate is full of the magnetic molding material, and then carrying out solidifying forming at a set solidification temperature and a set solidification pressure. ### Claim 3 (depends on 1) The processing method of the surface-mounted transformer according to claim 1, wherein the magnetic molding material is made by mixing of Ni—Zn ferrite powder and a thermosetting epoxy molding material, wherein in a mixture of the Ni—Zn ferrite powder and the thermosetting epoxy molding material, a weight percentage of the Ni—Zn ferrite powder is 20%-90%. ### Claim 4 (depends on 1) The processing method of the surface-mounted transformer according to claim 1, the electrodes are Ag—Ni—Sn 3-layer structural electrodes, the number of the electrodes is 8, and the electrodes are connected to free ends of 4 windings respectively; and the leading-out ends of the coil connected to the electrodes are led out in a right-angle manner. ### Claim 5 (depends on 1) The processing method of the surface-mounted transformer according to claim 1, wherein the coil is of a 3-layer structure and comprises 4 windings. ### Claim 6 (depends on 5) The processing method of the surface-mounted transformer according to claim 5, wherein a distance between an electrode surface and the adhesive layer is not smaller than 0.04 mm. ### Claim 7 (depends on 6) The processing method of the surface-mounted transformer according to claim 6, wherein the leading-out ends of the coil are welded and fixed by hot pressing. ### Claim 8 (depends on 1) The processing method of the surface-mounted transformer according to claim 1, wherein the adhesive layer is cuboid-shaped as a whole; the electrodes are exposed on a surface of the adhesive layer; and other surfaces of the adhesive layer are smooth surfaces.