Back to results
US 2025/0154400 A1Published application
Thermal conductive stacked insulative substrate
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroshi MOGI, Osamu UCHIDA, Atsushi YAGINUMA, Masaki MOTEKI
Life of this patent
Estimating the term…
Abstract
A thermal conductive stacked insulative substrate including: an elastic layer; and a thermal conductive ceramics insulative substrate, wherein the elastic layer is directly stacked on a surface of the thermal conductive ceramics insulative substrate. The thermal conductive stacked insulative substrate has a small thermal resistivity and excellent thermal conductivity.
Claims11
1-5. (canceled)
A thermal conductive stacked insulative substrate, comprising:
- an elastic layer;
- and
- a thermal conductive ceramics insulative substrate,
- wherein the elastic layer is directly stacked on a surface of the thermal conductive ceramics insulative substrate.
1 more element
Dependencies are inferred from the claim text.