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US 2025/0147418 A1Published application
Photosensitive resin composition, method for producing resist pattern film, and method for producing plated shaped article
AssigneeJsr Corporation
InventorsNaoki NISHIGUCHI, Ayako ENDO, Tomoyuki MATSUMOTO
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Abstract
A photosensitive resin composition includes a polymer (A), a photoacid generator (B), and an organic solvent (C). The polymer (A) includes: a structural unit having a phenolic hydroxy group; and a (meth)acrylate-derived structural unit having an acid-dissociable group. The organic solvent (C) includes 3-ethoxyethyl propionate. A solid content concentration of the photosensitive resin composition is 30 mass % or more.
Claims13
1:
- A photosensitive resin composition comprising:
- a polymer (A) that comprises:
- a structural unit having a phenolic hydroxy group;
- and a (meth)acrylate-derived structural unit having an acid-dissociable group;
- a photoacid generator (B);
- and
- an organic solvent (C) that comprises 3-ethoxyethyl propionate,
- wherein a solid content concentration of the photosensitive resin composition is 30 mass % or more.
5 more elements
2:
- The photosensitive resin composition according to claim 1, wherein the photoacid generator (B) comprises a compound represented by formula (B1):
- wherein, in the formula (B1), R11 is a hydrogen atom, a fluorine atom, a hydroxy group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or an alkoxycarbonyl group having 2 to 11 carbon atoms, R12 is an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkanesulfonyl group or an arylthio group having 1 to 10 carbon atoms, R13 and R14 are each independently an unsubstituted or substituted alkyl group having 1 to 10 carbon atoms, an unsubstituted or substituted phenyl group or naphthyl group, or R13 and R14 are bonded to each other to form a divalent group having 2 to 10 carbon atoms, k is an integer of 0 to 2, r is an integer of 0 to 10, X− is PF6−, BF4−, (CF3CF2)3PF3−, (C6F5)4B−, ((CF3)2C6H3)4B−, or an anion represented by any of formulae (b-1) to (b-4):
- R15CpHqFrSO3−:
- (b-1)
- R15SO3−:
- (b-2)
- wherein, in formulae (b-1) and (b-2), R15 is a hydrogen atom, a fluorine atom, or a substituted or unsubstituted hydrocarbon group having 1 to 12 carbon atoms, p is an integer of 1 to 10, q and r are integers satisfying 2p=q+r, and r≠0,
- wherein, in formula (b-3), R16 and R17 are each independently a fluorine-substituted alkyl group having 1 to 10 carbon atoms, or R16 and R17 are bonded to each other to form a divalent fluorine-substituted alkylene group having 2 to 10 carbon atoms, and
- wherein, in formula (b-4), R18, R19, and R20 are each independently a fluorine-substituted alkyl group having 1 to 10 carbon atoms, and optionally two of R18, R19, and R20 are bonded to each other to form a divalent fluorine-substituted alkylene group having 2 to 10 carbon atoms.
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3:
- The photosensitive resin composition according to claim 1, wherein the organic solvent (C) further comprises an organic solvent which is other than 3-ethoxyethyl propionate and has a boiling point in a range of 120° C. to 180° C.
4:
- The photosensitive resin composition according to claim 1, wherein the organic solvent (C) comprises at least one organic solvent selected from the group consisting of propylene glycol methyl ether acetate (PGMEA), 3-methoxybutyl acetate (3MBA), 3-methoxymethyl propionate, diethylene glycol methyl ethyl ether, 2-heptanone, and ethyl lactate.
5:
- The photosensitive resin composition according to claim 1, wherein the organic solvent (C) comprises at least one organic solvent selected from the group consisting of propylene glycol methyl ether acetate and 3-methoxybutyl acetate.
6:
- The photosensitive resin composition according to claim 1, wherein the organic solvent (C) comprises 20 mass % or more of 3-ethoxyethyl propionate.
7:
- A method for producing a resist pattern film, the method comprising:
- applying the photosensitive resin composition according to claim 1 onto a substrate to form a resin coating film;
- exposing the resin coating film to light;
- and
- developing the resin coating film after exposure to form a resist pattern.
2 more elements
8:
- The method according to claim 7, wherein the resist pattern is a line-and-space pattern.
9:
- The method according to claim 7, wherein the resist pattern is a circular or polygonal columnar pattern.
10:
- The method according to claim 7, wherein a film thickness of the resin coating film is 20 μm or more.
11:
- A method for producing a plated shaped article, the method comprising:
- producing a resist pattern film by the method according to claim 7;
- and
- performing a plating treatment on the substrate using the resist pattern film as a mask to obtain the plated shaped article.
1 more element
12:
- The method according to claim 11, wherein the plated shaped article has a line shape.
13:
- The method according to claim 11, wherein the plated shaped article has a circular or polygonal columnar pattern.