# US 2025/0147346 A1 · Electrooptic or optoelectric integrated circuit enabling a bias-tee and method for fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0147346 A1 - Document ID: US20250147346A1 - Status: Published application - Kind: A1 - Application number: 18/835,692 - Filed: 2023-02-01 - Published: 2025-05-08 - Earliest claimed: 2022-02-04 - Assignees: ETH Zurich - Applicants: Eth Zurich - Inventors: David MOOR; Juerg LEUTHOLD - Web page: https://patentgrep.com/patent/US20250147346A1 ## CPC - G02F 1/0305: {Constructional arrangements (G02F1/0327 - G02F1/05 take precedence)} - G02F 1/0356: {controlled by a high-frequency electromagnetic wave component in an electric waveguide structure} - H04B 3/03: Hybrid circuits (for transceivers H04B1/52, H04B1/58) - H10F 30/221: the potential barrier being a PN homojunction - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H04B: TRANSMISSION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract The invention relates to an integrated circuit (1), comprising: a substrate (10) which supports an electrooptic or optoelectric transducer (11) and a capacitor (12), wherein at least one electrically conductive element of the transducer (11) and at least one electrically conductive element of the capacitor (12) are arranged at the same level with respect to the substrate (10). The invention further relates to a method for fabricating the same. ## Claims ### Claim 1 An integrated circuit, comprising: a substrate which supports an electrooptic or optoelectric transducer and a capacitor, wherein at least one electrically conductive element of the transducer and at least one electrically conductive element of the capacitor are arranged at the same level with respect to the substrate. ### Claim 2 (depends on 1) The integrated circuit of claim 1, wherein one or more elements or one or more groups of elements of the capacitor have the same form as an element or a group of elements of the transducer. ### Claim 3 (depends on 1) The integrated circuit of claim 1, wherein a group of elements of the transducer includes a waveguide arranged between two electrodes. ### Claim 4 (depends on 1) The integrated circuit of claim 1, wherein a group of elements of the transducer includes a doped silicon element supporting an electrode. ### Claim 5 (depends on 1) The integrated circuit of claim 1, wherein a group of elements of the transducer includes a nonlinear element arranged between two electrodes. ### Claim 6 (depends on 1) The integrated circuit of claim 1, wherein a group of elements of the transducer includes a doped region of the substrate arranged between two electrodes. ### Claim 7 (depends on 1) The integrated circuit of claim 1, wherein the transducer includes a plasmonic waveguide. ### Claim 8 (depends on 1) The integrated circuit of claim 1, wherein the transducer includes a photonic waveguide. ### Claim 9 (depends on 1) The integrated circuit of claim 1, wherein the substrate includes an area at a first level for supporting the transducer and an area at a second level different from the first level for supporting the capacitor, and wherein the same level of the at least one electrically conductive element of the transducer respectively of the capacitor is defined with respect to the first level of the substrate respectively with respect to the second level of the substrate. ### Claim 10 (depends on 1) The integrated circuit of claim 1, wherein the at least one electrically conductive element of the transducer includes a first electrode and the at least one electrically conductive element of the capacitor includes a coupled capacitor plate, wherein a part of the coupled capacitor plate coincides with the first electrode. ### Claim 11 (depends on 1) The integrated circuit of claim 1, wherein the capacitor includes a coupled capacitor plate for coupling with the transducer and a decoupled capacitor plate for receiving a high-frequency signal. ### Claim 12 (depends on 1) The integrated circuit of claim 1, wherein the capacitor has the form of a finger capacitor. ### Claim 13 (depends on 1) The integrated circuit of claim 1, wherein the substrate further supports an inductor having one end for coupling with the transducer and another end for receiving a low-frequency or direct current signal. ### Claim 14 A method for fabricating an integrated circuit, wherein a substrate is provided, and wherein a transducer and a capacitor are arranged on the substrate using a single fabrication process, wherein at least one electrically conductive element of the transducer and at least one electrically conductive element of the capacitor are arranged at the same level with respect to the substrate. ### Claim 15 (depends on 14) The method of claim 14, wherein an inductor is arranged on the substrate using the single fabrication process.