# US 2025/0147249 A1 · Package structure and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0147249 A1 - Document ID: US20250147249A1 - Status: Published application - Kind: A1 - Application number: 18/503,194 - Filed: 2023-11-07 - Published: 2025-05-08 - Earliest claimed: 2023-11-07 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: John Hon-Shing Lau; Tzyy-Jang Tseng - Web page: https://patentgrep.com/patent/US20250147249A1 ## CPC - G02B 6/4249: {comprising arrays of active devices and fibres} - H10W 90/00: Package configurations - G02B 6/4293: {hybrid electrical and optical connections for transmitting electrical and optical signals} - G02B 6/4274: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)} - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package structure includes a package substrate, an application specific integrated circuit (ASIC), a plurality of optoelectronic assemblies, and a plurality of organic interposers. The ASIC is disposed on the package substrate and electrically connected to the package substrate. The optoelectronic assemblies are separately disposed on the package substrate and surround the ASIC. Each of the plurality of optoelectronic assemblies includes an electronic integrated circuit (EIC), a photonic integrated circuit (PIC), and a plurality of hybrid bonding pads. The EIC is bonded to the PIC through the plurality of hybrid bonding pads. The plurality of organic interposers are separately disposed on the package substrate and surround the ASIC. The optoelectronic assemblies are electrically connected to the package substrate through the plurality of organic interposers. ## Claims ### Claim 1 A package structure, comprising: a package substrate; an application specific integrated circuit, disposed on the package substrate and electrically connected to the package substrate; a plurality of optoelectronic assemblies, disposed on the package substrate, separated from each other and surrounding the application specific integrated circuit, wherein each of the plurality of optoelectronic assemblies comprises an electronic integrated circuit, a photonic integrated circuit, and a plurality of hybrid bonding pads, wherein the electronic integrated circuit is bonded on the photonic integrated circuit through the plurality of hybrid bonding pads; and a plurality of organic interposers, disposed on the package substrate, separated from each other and surrounding the application specific integrated circuit, wherein the plurality of optoelectronic assemblies are electrically connected to the package substrate through the plurality of organic interposers. ### Claim 2 (depends on 1) The package structure according to claim 1, wherein each of the plurality of optoelectronic assemblies further comprises an optical fiber cable that is connected to the photonic integrated circuit. ### Claim 3 (depends on 1) The package structure according to claim 1, wherein each of the plurality of optoelectronic assemblies further comprises an encapsulant that covers the electronic integrated circuit and the photonic integrated circuit and exposes a bottom surface of the photonic integrated circuit. ### Claim 4 (depends on 1) The package structure according to claim 1, further comprising: a plurality of conductive elements, disposed between the plurality of optoelectronic assemblies and the plurality of organic interposers, wherein the photonic integrated circuit has a plurality of through silicon vias and is electrically connected to each of the corresponding organic interposers through the plurality of through silicon vias and the plurality of conductive elements. ### Claim 5 (depends on 4) The package structure according to claim 4, wherein each of the plurality of conductive elements comprises a bump or a Cu-pillar with solder bump cap. ### Claim 6 (depends on 1) The package structure according to claim 1, further comprising: a plurality of first conductive elements, disposed between the application specific integrated circuit and the package substrate, wherein the application specific integrated circuit is electrically connected to the package substrate through the plurality of first conductive elements; and a plurality of second conductive elements, disposed between the plurality of organic interposers and the package substrate, wherein the plurality of organic interposers are electrically connected to the package substrate through the plurality of second conductive elements. ### Claim 7 (depends on 6) The package structure according to claim 6, wherein the package substrate further comprises a connecting circuit, and the plurality of first conductive elements are electrically connected to the plurality of second conductive elements through the connecting circuit. ### Claim 8 (depends on 6) The package structure according to claim 6, wherein each of the plurality of first conductive elements and each of the plurality of second conductive elements separately comprises a solder ball. ### Claim 9 (depends on 1) The package structure according to claim 1, wherein each of the plurality of organic interposers comprises a redistribution layer structure. ### Claim 10 (depends on 1) The package structure according to claim 1, wherein one side of the application specific integrated circuit comprises at least one organic interposer among the plurality of organic interposers and four optoelectronic assemblies among the plurality of optoelectronic assemblies. ### Claim 11 A manufacturing method of a package structure, comprising: providing a plurality of optoelectronic assemblies, each having an electronic integrated circuit, a photonic integrated circuit, and a plurality of hybrid bonding pads, wherein the electronic integrated circuit is bonded on the photonic integrated circuit through the plurality of hybrid bonding pads; providing a plurality of organic interposers; assembling the plurality of optoelectronic assemblies on the plurality of organic interposers; assembling an application specific integrated circuit on a package substrate, wherein the application specific integrated circuit is electrically connected to the package substrate; and assembling the plurality of organic interposers and the plurality of optoelectronic assemblies assembled thereon onto the package substrate, wherein the plurality of organic interposers and the plurality of optoelectronic assemblies assembled thereon surround the application specific integrated circuit and are electrically connected to the package substrate.