# US 2025/0146952 A1 · Substrate state measurement device, plating apparatus, and substrate state measurement method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0146952 A1 - Document ID: US20250146952A1 - Status: Published application - Kind: A1 - Application number: 18/557,557 - Filed: 2022-08-26 - Published: 2025-05-08 - Earliest claimed: 2022-08-26 - Assignees: Ebara Corporation - Applicants: Ebara Corporation - Inventors: Masashi SHIMOYAMA; Yasuyuki MASUDA; Ryosuke HIWATASHI - Web page: https://patentgrep.com/patent/US20250146952A1 ## CPC - G01N 21/9501: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} - C25D 5/02: Electroplating of selected surface areas - C25D 7/00: Electroplating characterised by the article coated - C25D 7/12: Semiconductors - C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer} - C25D 17/00: Constructional parts, or assemblies thereof, of cells for electrolytic coating - C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells} - C25D 17/06: Suspending or supporting devices for articles to be coated - C25D 21/12: Process control or regulation (controlling or regulating in general G05) - H10P 14/46: using a liquid - H10P 74/00: Testing or measuring during manufacture or treatment of wafers, substrates or devices - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A state of a substrate as a plating target is measured. A substrate state measurement device includes: a stage configured to support a substrate such that the stage rotates the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage; and a state measurement module adapted to measure a state of a power supply member contact area on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member. ## Claims ### Claim 1 A substrate state measurement device comprising: a stage configured to support a substrate such that the stage is able to rotate the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; and at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage, wherein a state of a power supply member contact area is measured on the basis of detection performed by the white confocal sensor on the power supply member contact area, the power supply member contact area being an area on the substrate which comes into contact with a power supply member. ### Claim 2 A substrate state measurement device comprising: a stage configured to support a substrate such that the stage is able to rotate the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; and at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage, wherein a state of a sealing member contact area is measured on the basis of detection performed by the white confocal sensor on the sealing member contact area, the sealing member contact area being an area on the substrate which comes into contact with a sealing member. ### Claim 3 A substrate state measurement device comprising: a stage configured to support a substrate such that the stage is able to rotate the substrate, the substrate including a seed layer and a resist layer formed on the seed layer; and at least one white confocal sensor adapted to measure a plate surface of the substrate supported by the stage, wherein a state of a plated area is measured on the basis of detection performed by the white confocal sensor on the plated area on the substrate. ### Claim 4 (depends on 3) The substrate state measurement device according to claim 3, wherein the detection performed by the white confocal sensor on the plated area on the substrate is performed on an area of not more than 25% of the plated area. ### Claim 5 (depends on 3, 4) The substrate state measurement device according to claim 3 or 4, wherein an aperture ratio of the resist layer in the plated area is measured as a state of the plated area. ### Claim 6 (depends on 5) The substrate state measurement device according to claim 5, comprising: a storage unit that stores a learning model constructed through machine learning, wherein learning of the learning model is performed by inputting detection information obtained by the white confocal sensor to the learning model, and the aperture ratio of the resist layer in the plated area is measured by using the learning model. ### Claim 7 (depends on 1, 2, 3) The substrate state measurement device according to any one of claims 1 to 3, comprising: a sensor moving mechanism configured to move the white confocal sensor along the plate surface of the substrate. ### Claim 8 (depends on 1, 2, 3) The substrate state measurement device according to any one of claims 1 to 3, wherein the at least one white confocal sensor includes a first white confocal sensor adapted to detect the power supply member contact area and a second white confocal sensor adapted to detect an area other than the power supply member contact area on the substrate. ### Claim 9 (depends on 1, 2, 3) A plating apparatus comprising: the substrate state measurement device according to any one of claims 1 to 3; a substrate holder including the power supply member and adapted to hold the substrate; and a plating tank adapted to accommodate a plating solution and perform plating by applying a voltage between the substrate and an anode in a state where the substrate held by the substrate holder and the anode are immersed in the plating solution. ### Claim 10 A substrate state measurement method comprising: arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer; detecting a power supply member contact area by a white confocal sensor while rotating the substrate arranged on the stage, the power supply member contact area being an area on the substrate which comes into contact with a power supply member; and measuring a state of the power supply member contact area on the basis of detection performed by the white confocal sensor. ### Claim 11 A substrate state measurement method comprising: arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer; detecting a sealing member contact area by a white confocal sensor while rotating the substrate arranged on the stage, the sealing member contact area being an area on the substrate which comes into contact with a sealing member; and measuring a state of the sealing member contact area on the basis of detection performed by the white confocal sensor. ### Claim 12 A substrate state measurement method comprising: arranging a substrate on a stage, the substrate including a seed layer and a resist layer formed on the seed layer; detecting a plated area on the substrate by a white confocal sensor while rotating the substrate arranged on the stage; and measuring a state of the plated area on the basis of detection performed by the white confocal sensor.