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US 2025/0146191 A1Published application
Glass cloth, prepreg and printed wiring board
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsAmane HIROSE, Yuka HASHIMOTO
Life of this patent
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Abstract
The present disclosure relates to a glass cloth, prepreg, and printed circuit board. There is provided a glass cloth including woven glass yarns, wherein a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less, a bending rigidity (gf-cm/cm) per warp direction basis weight (g/m2) of the glass cloth is in the range of 0.0002 to 0.0014, and a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.
Claims21
A glass cloth, comprising woven glass yarns, wherein
- a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less,
- a bending rigidity (gf·cm2/cm) per warp direction basis weight (g/m2) of the glass cloth is in the range of 0.0002 to 0.0014, and
- a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.
A glass cloth, comprising woven glass yarns, wherein
- a bulk dissipation factor of a glass in the glass yarns is 0.0010 or less,
- a bending hysteresis (gf·cm/cm) per square of the warp direction basis weight (g/m2) of the glass cloth is in the range of 2.6 to 4.0, and
- a dissipation factor of the glass cloth at 10 GHz is in the range of greater than 0 and 0.0010 or less.
(canceled)
Dependencies are inferred from the claim text.