# US 2025/0145877 A1 · Thermally conductive silicone composition and method for producing thermally conductive cured product using the composition

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- Number: US 2025/0145877 A1
- Document ID: US20250145877A1
- Status: Published application
- Kind: A1
- Application number: 18/836,761
- Filed: 2023-01-18
- Published: 2025-05-08
- Earliest claimed: 2022-02-22
- Assignees: Wacker Chemie AG
- Applicants: Wacker Chemie AG
- Inventors: Kazuya SAKAI; Yurina SATO; Shunsuke YAMADA
- Web page: https://patentgrep.com/patent/US20250145877A1

## CPC

- C08L 83/04: Polysiloxanes
- C09K 5/14: Solid materials, e.g. powdery or granular
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C09D 7/61: inorganic
- C09D 7/70: {characterised by shape, e.g. fibres, flakes or microspheres}
- C09D 183/04: Polysiloxanes
- H10W 74/473: {containing a filler}
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/70: {Siloxanes defined by use of the MDTQ nomenclature}
- C08K 7/18: inorganic
- C08K 2003/2227: {of aluminium}
- C08K 2201/001: Conductive additives
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

Provided is a thermally conductive insulating silicone composition that has favorable thermal conductivity and dispensing properties, has favorable resiliency after curing, and can secure adhesion even under application of impact. Also provided is a method for manufacturing such a thermally conductive insulating silicone composition. The thermally conductive silicone composition is applied in a liquid state to a substrate, and contains: (A) a diorganopolysiloxane having an alkenyl group bonded to a silicon atom; (B) a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom; (C) a thermally conductive filler; (D) a silicone resin having at least one alkenyl group within one molecule, with a number-average molecular weight of 1,000 or more; and (E) an addition reaction catalyst. The content of the component (C) is 300 parts by mass or more and 2,000 parts by mass or less and the content of the component (D) is 1 part by mass or more, relative to 100 parts by mass of the total amount of the components (A) and (B).

## Claims

### Claim 1

A thermally conductive silicone composition that is applied in a liquid state to a substrate, the composition comprising:
a component (A) that is a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less;
a component (B) that is a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less;
a component (C) that is a thermally conductive filler;
a component (D) that is a silicone resin having at least one alkenyl group within one molecule, with a number-average molecular weight of 1,000 or more; and
a component (E) that is an addition reaction catalyst, wherein
a content of the component (C) is 300 parts by mass or more and 2,000 parts by mass or less relative to 100 parts by mass of a total amount of the components (A) and (B), and
a content of the component (D) is 1 part by mass or more relative to 100 parts by mass of the total amount of the components (A) and (B).

### Claim 2 (depends on 1)

The thermally conductive silicone composition according to claim 1, wherein the component (D) has one or more alkenyl groups bonded to silicon atoms within one molecule and contains a silicone resin constituted of an MQ unit containing an R23SiO1/2 unit (M unit) and an SiO1/2 unit (Q unit).

### Claim 3 (depends on 1, 2)

The thermally conductive silicone composition according to claim 1 or 2, wherein when the total amount of the components (A) and (B) is 100 parts by mass, a multiplicative product of an amount of the component (D) contained in parts by mass with the number-average molecular weight of the component (D) is 3,000 or more.

### Claim 4 (depends on 1, 2, 3)

The thermally conductive silicone composition according to any one of claims 1 to 3, wherein the component (C) is a thermally conductive filler selected from the group consisting of a metal, an oxide, a hydroxide, and a nitride.

### Claim 5 (depends on 1, 2, 3, 4)

The thermally conductive silicone composition according to any one of claims 1 to 4, comprising no organosilicon compound having one or more alkenyl groups and one or more alkoxy groups bonded to silicon atoms within one molecule.

### Claim 6

A method for improving a resiliency of a cured product obtained by curing a thermally conductive silicone composition, the method comprising:
adding a component (D) that is a silicone resin having a number-average molecular weight of 1,000 or more to a thermally conductive silicone composition that contains a component (A) that is a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, with a viscosity, at 25° C., of 10 mPa·s or more and 1,000,000 mPa·s or less, a component (B) that is a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, with a viscosity, at 25° C., of 10 mPa·s or more and 1,000,000 mPa·s or less, a component (C) that is a thermally conductive filler, and a component (E) that is an addition reaction catalyst;
applying the resulting thermally conductive silicone composition in a liquid state to a substrate; and
curing the thermally conductive silicone composition to obtain the cured product with an improved resiliency.

### Claim 7

A method for producing a gap filler, comprising:
applying, to a substrate, a thermally conductive silicone composition in a liquid state, the composition containing
a component (A) that is a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less,
a component (B) that is a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less,
a component (C) that is a thermally conductive filler,
a component (D) that is a silicone resin having at least one alkenyl group within one molecule, with a number-average molecular weight of 1,000 or more, and
a component (E) that is an addition reaction catalyst, wherein
a content of the component (C) is 300 parts by mass or more and 2,000 parts by mass or less relative to 100 parts by mass of a total amount of the components (A) and (B), and
a content of the component (D) is 1 part by mass or more relative to 100 parts by mass of the total amount of the components (A) and (B); and
curing the applied thermally conductive silicone composition.

### Claim 8

A gap filler comprising a cured product of a thermally conductive silicone composition, wherein:
the composition containing
a component (A) that is a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less,
a component (B) that is a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, with a viscosity at 25° C. of 10 mPa·s or more and 1,000,000 mPa·s or less,
a component (C) that is a thermally conductive filler,
a component (D) that is a silicone resin having at least one alkenyl group within one molecule, with a number-average molecular weight of 1,000 or more, and
a component (E) that is an addition reaction catalyst;
the gap filler exhibits an improved resiliency due to the component (D) added to the composition; and
a content of the component (C) is 300 parts by mass or more and 2,000 parts by mass or less, and a content of the component (D) is 1 part by mass or more and 10 parts by mass or less, relative to 100 parts by mass of a total amount of the components (A) and (B) in the thermally conductive silicone composition.

### Claim 9 (depends on 8)

An electronic device comprising the gap filler according to claim 8.