Slurry composition for polishing metal film
AssigneeKctech Co., Ltd.
InventorsJin Sook HWANG, Se Jin LIM
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Abstract
A slurry composition for polishing a metal film, and a method for chemical mechanical polishing (CMP) of a substrate using the slurry composition are provided. The slurry composition includes a polishing regulator, and the polishing regulator includes a copolymer comprising a polymer with an allylamine-based structural unit and a polymer with a structural unit including at least one element among sulfur (S), phosphorus (P), and nitrogen (N).
Claims18
A slurry composition for polishing a metal film, the slurry composition comprising a polishing regulator,
- wherein the polishing regulator comprises a copolymer comprising a polymer with an allylamine-based structural unit and a polymer with a structural unit comprising at least one element selected from a group consisting of sulfur (S), phosphorus (P), and nitrogen (N).
A method for chemical mechanical polishing (CMP) of a substrate, the method comprising:
- bringing the substrate into contact with a slurry composition for polishing a metal film;
- and
- polishing the substrate with the slurry composition,
- wherein the slurry composition comprises a polishing regulator,
- wherein the polishing regulator comprises a copolymer comprising a polymer with an allylamine-based structural unit and a polymer with a structural unit comprising at least one element selected from a group consisting of sulfur (S), phosphorus (P), and nitrogen (N).
Dependencies are inferred from the claim text.