# US 2025/0145262 A1 · Feedthroughs for enclosures in deep water vessels > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2025/0145262 A1 - Document ID: US20250145262A1 - Status: Published application - Kind: A1 - Application number: 18/954,411 - Filed: 2024-11-20 - Published: 2025-05-08 - Earliest claimed: 2020-10-14 - Assignees: Aqua Satellite, Inc. - Applicants: Aqua Satellite, Inc. - Inventors: Robert Alan Eustace - Web page: https://patentgrep.com/patent/US20250145262A1 ## CPC - B63G 8/04: Superstructure - H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring} - B63B 3/13: Hulls built to withstand hydrostatic pressure when fully submerged, e.g. submarine hulls - H01R 43/20: for assembling or disassembling contact members with insulating base, case or sleeve - B63G: OFFENSIVE OR DEFENSIVE ARRANGEMENTS ON VESSELS; MINE-LAYING; MINE-SWEEPING; SUBMARINES; AIRCRAFT CARRIERS (means of attack or defence in general, e.g. turrets F41H) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B63B: SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING (arrangements of vessel ventilation, heating, cooling, or air-conditioning B63J2/00; floating substructures as supports of dredgers or soil-shifting machines E02F9/06) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract An enclosure structure suitable for high-pressure environments includes a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure. The enclosure structure includes a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing and a bore through the housing. The one or more electronic components comprises a connector element and the bore comprises a non-tapered portion and a tapered portion. The non-tapered portion is proximate to the interior of the housing and the tapered portion is proximate to the exterior of the housing. The bore is configured to receive a feedthrough pin for coupling the connector element to an external component external to the enclosure structure. The enclosure structure also includes a feedthrough pin extending through the bore and a potting material disposed within the tapered portion surrounding the feedthrough pin. ## Claims ### Claim 1 (canceled) ### Claim 2 A method of manufacturing an enclosure structure with a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure, the method comprising: forming a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing, wherein the one or more electronic components comprises a connector element; forming a bore through the housing; inserting a feedthrough pin through the bore for coupling the connector element to an external component external to the enclosure structure, wherein a first end of the connector element is configured to be coupled to the connector element and a second end of the connector element is configured to be coupled to the external component; and disposing a housing cap on an exterior of the housing, wherein the feedthrough pin is configured to extend through an aperture of the housing cap to an exterior of the housing. ### Claim 3 (depends on 2) The method of claim 2, further comprising: disposing a potting material within the bore surrounding the feedthrough pin. ### Claim 4 (depends on 3) The method of claim 3, wherein the housing cap disposed along the exterior of the housing over the potting material. ### Claim 5 (depends on 3) The method of claim 3, wherein the bore comprises a non-tapered portion and a tapered portion, the non-tapered portion being proximate to the interior of the housing and the tapered portion being proximate to an exterior of the housing. ### Claim 6 (depends on 5) The method of claim 5, wherein the tapered portion comprises an interior end facing the interior of the housing and an exterior end facing an exterior of the housing, wherein a cross-section of the interior end is less than a cross-section of the exterior end. ### Claim 7 (depends on 5) The method of claim 5, wherein the non-tapered portion comprises a cylindrical portion, and wherein the tapered portion comprises a conical portion. ### Claim 8 (depends on 2) The method of claim 2, further comprising: placing the housing within an envelope; and causing the feedthrough pin to extend to an exterior of the envelope. ### Claim 9 (depends on 8) The method of claim 8, further comprising causing the feedthrough pin to extend through an envelope cap disposed on the exterior of the envelope. ### Claim 10 (depends on 9) The method of claim 9, wherein the envelope cap comprises: an envelope-cap bore through which the feedthrough pin extends, the envelope-cap bore comprising a tapered portion; and a potting material disposed within the envelope-cap bore to surround the feedthrough pin so as to create a seal around the feedthrough pin. ### Claim 11 (depends on 8) The method of claim 8, further comprising disposing an envelope cap on the exterior of the envelope around the feedthrough pin so as to create a seal around the feedthrough pin. ### Claim 12 (depends on 8) The method of claim 8, further comprising: extending the feedthrough pin through an elongated portion of the envelope to the exterior of the envelope; and disposing a sealing structure around at least part of the elongated portion so as to create a seal between the elongated portion and the feedthrough pin. ### Claim 13 (depends on 12) The method of claim 12, wherein the sealing structure comprises a heat shrink tubing, wherein disposing the sealing structure comprises: placing the heat shrink tubing around the elongated portion; and applying heat to the heat shrink tubing to cause the heat shrink tubing to shrink and wrap around the elongated portion and the feedthrough pin. ### Claim 14 An enclosure structure suitable for high-pressure environments, the enclosure structure having a feedthrough for coupling components housed within the enclosure structure to components external to the enclosure structure, the enclosure structure comprising: a housing comprising one or more cavities for receiving one or more electronic components within an interior of the housing, wherein the one or more electronic components comprises a connector element; a bore through the housing; a feedthrough pin extending through the bore, the feedthrough pin having a first end and a second end, wherein the first end is configured to be coupled to the connector element and the second end is configured to be coupled to the external component; a potting material disposed within the bore surrounding the feedthrough pin; and an envelope surrounding the housing. ### Claim 15 (depends on 14) The enclosure structure of claim 14, further comprising an envelope cap on an exterior of the envelope around the feedthrough pin so as to create a seal around the feedthrough pin, the envelope cap comprises: an envelope-cap bore through which the feedthrough pin extends, the envelope-cap bore comprising a tapered portion; and a potting material disposed within the envelope-cap bore to surround the feedthrough pin so as to create a seal around the feedthrough pin. ### Claim 16 (depends on 15) The enclosure structure of claim 15, wherein the feedthrough pin extends through an elongated portion of the envelope to the exterior of the envelope; and a sealing structure is disposed around at least part of the elongated portion so as to create a seal between the elongated portion and the feedthrough pin. ### Claim 17 (depends on 16) The enclosure structure of claim 16, wherein the sealing structure comprises a heat shrink tubing. ### Claim 18 (depends on 16) The enclosure structure of claim 16, wherein the sealing structure is disposed over both the feedthrough pin and the elongated portion. ### Claim 19 (depends on 14) The enclosure structure of claim 14, wherein the potting material is an epoxy. ### Claim 20 (depends on 14) The enclosure structure of claim 14, wherein the bore comprises a non-tapered portion and a tapered portion, the non-tapered portion being proximate to the interior of the housing and the tapered portion being proximate to an exterior of the housing, wherein the tapered portion comprises an interior end facing the interior of the housing and an exterior end facing an exterior of the housing, wherein a cross-section of the interior end is less than a cross-section of the exterior end. ### Claim 21 (depends on 14) The enclosure structure of claim 14, wherein the envelope is impermeable to water when the enclosure structure is held at 15,750 pounds per square inch, and wherein the feedthrough pin extends to an exterior of the envelope.