Joint body, semiconductor device equipped with joint body, and joint body production method
AssigneeMitsubishi Electric Corporation
InventorTatsuya KITAGAWA
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Abstract
A joint body of the present disclosure includes a metal member and a resin member joined to the metal member, the metal member has a dendritic structure portion on a surface joined to the resin member, at least a part of the dendritic structure portion has a nanometer-order diameter, and the resin member permeates through the dendritic structure portion. Such a configuration can ensure an adequate contact area between the resin member and the nanometer-order dendritic structure portion formed on the metal member, so that it is possible to obtain a joint body in which the metal member and the resin member are firmly joined together.
Claims13
A joint body comprising:
- a metal member:
- and
- a resin member joined to the metal member,
- wherein
- the metal member has a dendritic structure portion on a surface joined to the resin member,
- at least a part of the dendritic structure portion has a nanometer-order diameter, and
- the resin member permeates through the dendritic structure portion.
A joint body production method comprising:
- a surface treatment process of forming a depression and a dendritic structure portion on a surface of a metal member, at least a part of the dendritic structure portion having a nanometer-order diameter;
- and
- a joining process of causing a resin member to permeate through the dendritic structure portion to join the metal member and the resin member together,
- wherein the surface treatment process is performed by irradiating one region with a single pulsed laser, and
- the surface treatment process is performed by the pulsed laser having a pulse width of less than or equal to 10 ns and an energy density of greater than or equal to 5 J/cm2 and less than or equal to 30 J/cm2.
(canceled)
Dependencies are inferred from the claim text.